Products
Copper Glass-Coated Micro Wire features glass insulation for use in semiconductor wire bonding. Is a replacement to traditional copper bonding wire or gold wire. Is cast, not drawn, to enable a soft metal core with a high strength, ultra-fine glass coating. Is said to eliminate anti-oxidation, enabling a longer shelf life. Supports larger spools, for simpler materials management. Protects against shorts since the wire is coated and cannot make contact. Scale to 4 microns.
RED Micro Wire, redequipment.com
Vision System Alignment provides fiducial location (used to align the PCB to the stencil in X/Y/Theta) and post-print inspection (used to detect over and under print). Uses a high-resolution 1024 x 768 pixel resolution camera system. Fiducial location function features pattern recognition to locate fiducials on the PCB and stencil. Includes multi-stage sub pixeling algorithms. 2-D Post-Print Inspection function reportedly ensures proper solder paste application to the printed circuit board with a field of view of 63 mm2 and an inspection shot rate of < 220 ms. Grayscale-based inspection detects excess solder paste and insufficient solder paste.
Milara, www.milarasmt.com
Vision System Alignment provides fiducial location (used to align the PCB to the stencil in X/Y/Theta) and post-print inspection (used to detect over and under print). Uses a high-resolution 1024 x 768 pixel resolution camera system. Fiducial location function features pattern recognition to locate fiducials on the PCB and stencil. Includes multi-stage sub pixeling algorithms. 2-D Post-Print Inspection function reportedly ensures proper solder paste application to the printed circuit board with a field of view of 63 mm2 and an inspection shot rate of < 220 ms. Grayscale-based inspection detects excess solder paste and insufficient solder paste.
Milara, www.milarasmt.com
Press Releases
- SEMI Applauds Statement from Senators Crapo and Wyden Supporting U.S. Tax Credit for Semiconductor Manufacturing
- ECIA’s July Industry Pulse Sentiment Index Suffers Summer Slide and Dips 12.5 Points from June High
- Datest to Host Siemens EDA Webinar on Data-Driven PCB Test Planning for Increasingly Complex Electronics Designs
- StenTech Expands North American Manufacturing Capacity Through Strategic Investment