Products
Supreme 10HTF-1 single-part adhesive/sealant is for aerospace, electronics, optical and other applications. Is said to have an unlimited working life at room temperature and cures rapidly at elevated temperatures. Typical cure schedules are 5 to 10 min. at 300°F or 15 to 20 min. at 250°F. Delivers physical strength values for tensile lap shear, tensile and T-peel of >3,200 psi, 6,500-7,500 psi and 20-25 psi, respectively. Bonds to metals, composites, glass, ceramics, rubbers and many plastics. Has low shrinkage upon curing, is dimensionally stable and has a Shore D hardness >70. Withstands rigorous thermal cycling and mechanical shock and vibration. Offers cryogenic serviceability over the temperature range of 4K to +400°F. Resists water, fuels, acids, bases and many solvents. Is a reliable electrical insulator. Volume resistivity is 1013ohm-cm.
Master Bond, www.masterbond.com
Digital Position Setup Tool is designed for use on Ersa selective soldering machines such as Versaflow 3, Versaflow 4050 and Versaflow 5060. Can measure flux spray position up to 0.1mm position accuracy at the printed circuit board level. Deviations can be displayed on the machine or remotely. Machine verification is digitally controlled. Is designed for use with 3/6 nozzles; other nozzle options are available. Includes automatic calibration mode. Is compatible with other selective solder equipment depending on dimensions.
Kurtz Ersa North America, www.ersa.com
TestStation Multi-Site in-circuit test system features multiple test head support and concurrent test architecture to reportedly deliver two to four times productivity compared to conventional MDA/ICT systems. Inline automated handler is for high-speed, no-touch printed circuit board assembly test processing; supports panels up to 450 x 350mm, with up to 5,120 test points. Delivers mechanical board transport times of fewer than six sec.
UltraPin II 128HD channel card features 512 hybrid pins per card for high-complexity and high-density applications. Increases pin count to
15,360 pins. High-density channel card doubles system test point counts. Systems configured with 128HD can be configured to 15,360 test points.
LH ICT supports up to 4,096 test points. Multi-Site dual-site model supports two concurrently operating test heads in a footprint under 0.7 m2.
Permit moving to automated no-touch manufacturing test. Handler has dual-site support in an 850mm wide footprint; is designed to replace two to four times as many automatic or manual MDA/ICT systems.
Teradyne, www.teradyne.com
Press Releases
- Kurtz Ersa Partners with E-tronix for Sales in Illinois and Wisconsin
- XLR8 EMS Welcomes Raul Jorge Lopez Jr. as Director of Program Management and Procurement
- Koh Young America Promotes Ramiro Mora to Lead Service and Applications in Mexico and South America
- ViTrox Americas Welcomes Huy Pham as Technical Support Engineer