Products
EP17HT-100 is a single-part epoxy designed to cure in 60-90 min. at 200-220°F. Formulated for potting, encapsulation, bonding and sealing applications. Cures can be accelerated at higher temperatures. Is a moderate viscosity compound that can be cast in sections up to a 0.5" thick. Is not premixed and frozen. Reportedly has an unlimited working life at room temp. Offers volume resistivity of >1015 ohm-cm. Bonds well to metals, composites, ceramics, glass and many plastics. Exhibits a tensile lap shear strength exceeding 2,700 psi at ambient temp. after being post-cured for several hours at 350-400°F. Has thermal conductivity of 4-5 BTU·in/(hr·ft²·°F). Service temp. range -100°F to +500°F.
Master Bond, www.masterbond.com
CalcuQuote now reads and shares inventory master data with Manex through an application programming interface. Automatically ties bills of material (BoM) to their corresponding Manex part number, for easy viewing of part description, alternate part suggestions, Manex part number, standard cost, target price, part classification, and more.
VisionPDM, www.calcuquote.com
PF608-PI-21 (SnAg4.0Cu0.5/x) and PF606-P-BS1 (SnAg3.0Cu0.5/x) bumping solder pastes are designed to decrease voids in wafer bumping. Are said to offer excellent stencil printing transfer rates and void rates of <10%.
Shenmao America, www.shenmao.com
Press Releases
- XLR8 EMS Welcomes Raul Jorge Lopez Jr. as Director of Program Management and Procurement
- Koh Young America Promotes Ramiro Mora to Lead Service and Applications in Mexico and South America
- ViTrox Americas Welcomes Huy Pham as Technical Support Engineer
- XLR8 EMS Appoints Steve Dutton as Chief Sales Officer