News
Weymouth, UK -- DEK (www.dek.com) has developed a high throughput backside wafer coating process, hosted on a mass imaging platform and capable of exceeding the ± 12.5 µm total thickness variation (TTV) stipulated by most wafer processing specialists. The new process is compatible with underfill or adhesive-type coatings, normally applied at a nominal 50 µm thickness to the backside of semiconductor wafers ahead of singulation.
"TTV is the critical success factor for any backside wafer coating process," said Clive Ashmore of DEK's global applied process engineering group. "By demonstrating our ability to meet the established criteria for backside wafer processing, we have opened new opportunities for semiconductor packaging specialists to increase throughput and reduce the cost per package by using high accuracy mass imaging."
The new process is compatible with the company's metal stencil and emulsion screen technologies.
Ian deSouza, Universal senior vice president of operations and systems, was promoted to president, effective Aug. 16.
"I also look forward to the prospect of having very little to change. Our customers will notice no difference, except our continuing progress, growth and commitment," deSouza said in a press statement.
During the past three years, deSouza was responsibile for global supply chain, software development and manufacturing activities, including the company's new operations in China.
In a statement, Universal said DeSouza is considered the "right and natural choice" to take the company forward. For over three years he has been McEvoy's deputy.
"I welcome the opportunity to take the reins from an old friend who has distinguished himself well in the role," said deSouza.
McEvoy plans to return to the U.K., where his family resides. He is credited for pulling the company through the 2001-02 recession and returning it to profitability in 2003.
McEvoy and deSouza worked closely for the past 20 years, through prior stints at Domino Printing Science and Cambridge Instruments. They were colloquially known within Universal as the "two Ian's."
The top tier EMS company showed a GAAP net loss of $25.5 million, including a pretax charge of $51.5 million for restructuring. Celestica lost $39.8 million last year.
"Stable end markets, improved operating efficiency and benefits from cost cutting have allowed Celestica to show improvements in its second quarter results," said Steve Delaney, CEO, in a statement. "Our revenue is growing, our margins are improving, our European and Americas operations are profitable again and we are starting to show positive earnings momentum.
Celestica guided for third-quarter sales of $2.25 billion to $2.40 billion and adjusted earnings per share of 11 to 17 cents.
Celestica is continuing its acquisition of another major EMS firm, MSL. In a research note, Deutsche Bank forecast Celestica's internal restructuring, new program ramps and the acquisition of MSL would drive continued sequential operating improvement in the September quarter.
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