"This is an important business development for Reptron that increases our capacity to provide manufacturing services for the communications industry sector," said Bonnie Fena, president of Reptron Manufacturing Services.
Full production is expected to ramp by the end of 2004.
Under the deal, Reptron will build 150 different subassemblies and PCBs for wired and wireless intercommunications products. Much of the current phase involves converting from plated through-hole to to surface mount technology.
Clinton, NY -- Indium Corp. (indium.com) has released the results of a series of cleaning solvent compatibility evaluations. After extensive testing and analysis, the company found a high degree of effectiveness using a range of cleaning solvents from Zestron and Kyzen for the Indium's solder pastes, including lead-free.
The data are available by contacting abrown@indium.com.
Indium is a supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, lead-free solder alloys, underfill materials and die-attach materials.
Net income was $8.6 million, vs. $5.1 million last quarter and $1.2 million last year.
First-half revenues were up 33% to $144.7 million and net income rose 491% to $13.6 million.
PCB equipment sales were $29.4 million, up from $23.2 million sequentially and $18.5 million last year. Sales of assembly equipment were $8.8 million, up from $6.6 million in the first quarter and $6.1 million a year ago.
Cash and equivalents increased $14 million to $166 million during the quarter.
"Our confidence in the long-term growth prospects of these
industries continues to be high," said CEO Yochai Richter in a press
statement.