Assembly and Reliability of Preform Underfilmed BGAs in Drop Test and Thermal Cycling
Pb-free solders generally are inferior to Pb-free solders in drop or shock testing. Preform underfilms can provide greater BGA to PCB mechanical robustness in a fairly seamless way – attached on reels similar to passives and reflowed simultaneously with the components, with only a minor design change required. And the results are impressive.
by Andrew Mawer, Thomas Koschmieder, Paul Galles, Randy Anding, George Skevofilax and Tim Lippe
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