Automating the Documentation Process
“Documentation is much bigger than just design, fab and assembly,” experts say. A look at best-in-class processes that reduce the amount of time spent on drawings and notes by creating a “living” document.
by Mike Buetow
Best Practices for Double-Sided Mixed-Technology Boards
Plated through-hole assembly remains in use for some heavy power connectors, transformers and other devices where strong mechanical bonds are required. Reason: Heavy parts are prone to falling off during soldering.
by George Henning
A Critique of IPC-A-610E
The industry standard for visual acceptance criteria for post-assembly soldering and mechanical assembly requirements has been revised. A master trainer assesses the revised guidelines, looking at the many changes to package-on-package and leadless device packages, flex circuits, board-in-board connections and newer style SMT terminations.
by Bob Wettermann
Present and Future Solder Technologies
Next-gen product relies on advanced powder technologies, better flux formulations, and dual-function materials such as epoxy fluxes. How powders, activator chemistries and fluxes are evolving for production use.
by Neil Poole, Ph.D., and Brian Toleno, Ph.D.
Post-Reflow Residue Results Following pH-Neutral Cleaner Application
A study of 40 leaded and Pb-free solders compares alkaline to pH-neutral cleaning agents.
by Harald Wack, Ph.D., Joachim Becht, Ph.D., Michael McCutchen and Umut Tosun
Foxconn’s suicide cluster, in context.
Low cost: the death of innovation.
On the Forefront
LEDs’ bright future.
E. Jan Vardaman
A primer on nozzle types.
Ball attachment with preforms.
ACI Technologies Inc.
Test and Inspection
Eight steps to great ICT coverage.
Finer powders, more solder balling?
Dr. Davide Di Maio
Cleaning’s building blocks.
Dr. Harald Wack
The solar show circuit.
Soured by graping?
In Case You Missed It.