Are Your PCB Data Unprepared?
It is great to have a fabricator that can provide its “secret sauce” to make the design work, but be ready to get locked into that supplier, because another fabricator’s recipe will be different. As a designer, is that a risk you want to take?
by Jeff Champa
Why it is Necessary to Change the IC ESD Target Specification Levels
Since the mid 1980s, it has been industry practice to supply ICs with ESD protection, where possible, to meet 2kV HBM ESD. While IC suppliers make every effort to meet these established levels, customers tend to expect these same levels without exception for product qualification. However, numerous products have been shipped with ESD protection on some pins at lower levels to achieve desired performance. Despite this, field returns have not been observed to be different from the products shipped at, or exceeding, the normal target ESD levels. These observations clearly indicate the target ESD levels must be considerably higher than necessary. After 20 “static” years, more realistic measures are needed.
by Dr. Charvaka Duvvury, Dr. Harald Gossner and Dr. Jeremy Smallwood
High Accuracy 01005 Placement
To place 01005 components, the pick process must be very stable. As component spacing will be very narrow, the pickup point of the nozzle must be in the center of the component. Using laser alignment and novel placement force control, accuracy of 50 µm at 4-Sigma is achievable.
by Satoshi Kataoka and Eric Klaver
iNEMI’s Bill Bader.
China’s labor shortage.
Hello? Anyone there?
On the Forefront
Packaging over chips.
E. Jan Vardaman
The missing link.
The iconic (and ionic) residual flux.
Can DoD crack RoHS plating armor?
ACI Technologies Inc.
A bridge too far.
Parylene, under the (UV) light.
Dr. Davide Di Maio
Phase-change TIM technology.
In case you missed it.