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  • Buyers Guide
    2009-10 Circuits Assembly Buyers Guide
    Our annual guide to suppliers of equipment, materials and services for electronics assembly.

  • Cover Story
    A Novel Six Sigma SnPb Solder Paste
    Although Six Sigma principles have been used in the industry for years, for the most part they have been applied to PWB fabrication or assembly processes – not to product development, and certainly not to soldering materials themselves. The recent development of a new SnPb solder paste, however, combined modern raw materials and the application of these principles.
    By Steve Ratner, Martin Lopez, John McMaster, Frank Murch and Mike Skrzat


  • Caveat Lector
    The EMS sector's ongoing profit problem.
    Mike Buetow


  • Talking Heads
    Sanmina-SCI’s Sundar Kamath talks alternative energies.
    Mike Buetow
  • Focus on Business
    How program managers can beat the recession.
    Susan Mucha


  • Screen Printing
    The effect of printing and reflow on broadband boards.
    Dr. Rita Mohanty
  • Reflow Soldering
    When wetting rears its ugly head, check for missing pads.
    Ursula Marquez de Tino
  • Materials World
    Mitigating tin whisker risks through conformal coatings.
    Dr. Renzhe Zhao



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On the Cover:A new approach to solder paste development gets rid of "trial and error"

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