Surface Oxidation as a Tin Whisker Growth Mechanism
This study found that oxidation of tin coatings accelerates whisker formation. This may be related to a change in the state of stress in the surface. Moreover, a little bit of humidity can go a long way toward increasing the rate of whisker growth.
W. John Wolfgong, Ph.D., Bob Ogden, Robert Champaign and Barbara Waller
Gauging True Speed and Accuracy
Accuracy specifications rarely give a solid feel for what platforms are capable of or how tests are run. Proposed: new standards for measuring throughput based on production floor environments.
Switching to Pb-Free: Reflow Soldering
Unlike wave soldering systems, which directly contact Pb-free solder alloys, changing reflow, selective soldering and hand soldering equipment is easier. But it is not necessarily easy.
Novel Conductive Inks for Smart Label Applications
A new family of highly conductive silver inks for smart card and label antennas achieve significantly better and more stable electrical performance, using lower antenna profiles.
Paul Berry, Marjorie Dwane, Greg Butch and Denley Baghurst
Purchasing Manufacturing Process Equipment
One man's hypotheses on the procurement process, and why buyers are not only purchasing the equipment but the supplier.
A new model for comparing equipment.
Shean R. Dalton
Enclosed print heads face their pros and cons.
The SMTA difference.
Finally time for low-lead-content SnPb finish?
American Competitiveness Institute
Flux: The determinant factor?
Countdown to Pb-Free
Managing your whiskers.
Joe Smetana and Ron Gedney
Why flux likes a long reflow profile.
Setting up an ESD work area.
David E. Swenson
Teradyne's 3-D x-ray inspection system.
On the cover: Tin whiskers protruding from a tin-plated surface. (Photo courtesy Raytheon)