August 2020 Issue
Published: 28 July 2020
by Mike Buetow
- BGA package inspection using x-ray and ultrasound
- Leveraging systems and processes to evolve NPI
- Recommendations for ensuring long-term access to key component packages
- Rethinking and repurposing marketing dollars
- Navigating the flex circuit roadmap
- Remote access to process equipment
- Lifted parts, their causes and remedies
- Low-temperature solders
- Download the pdf
Press Releases
- ASC International Expands Capabilities in Automated Optical Inspection
- Europlacer Expands U.S. Reach with New Eastern Region Representative
- Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
- Sierra Space Announces Opening of New “Power Station” Technology Center in Colorado as Defense Operations Grow
POPULAR
- Editorial Contributions
- Smarter SMT Starts at the Reel: How Splicing Kits are Powering Efficiency
- Verifying PCBA Cleanliness with Ion Chromatography
- Factors Contributing to Solder Ball Formation: A Guide
- Systematic Troubleshooting in Electronics Assembly: A Case Study in Solder Balling and Process Optimization