August 2020 Issue
Published: 28 July 2020
by Mike Buetow
- View the digital issue
- BGA package inspection using x-ray and ultrasound
- Leveraging systems and processes to evolve NPI
- Recommendations for ensuring long-term access to key component packages
- Rethinking and repurposing marketing dollars
- Navigating the flex circuit roadmap
- Remote access to process equipment
- Lifted parts, their causes and remedies
- Low-temperature solders
- Download the pdf
Press Releases
- Orbit International’s Electronics Group Receives Two New Orders in September Totaling Approximately $2,100,000
- Z-AXIS Adds $1.2M in Equipment for Printed Circuit Board and Cable Assembly Services
- Reduced voids for highest quality demands
- Spartronics Appoints Craig Rupp, Vice President & General Manager of Aerospace & Defense Markets and Gregory Bradfield, Vice President of Operations