April 2020 Issue
Published: 23 April 2020
by Mike Buetow
- BGA pitch impacts on bare board fabrication
- Future aerospace and defense product requirements
- Cleaning and drying before conformal coating
- Crisis communications strategies
- Nepcon Japan recap
- Cleaning small PCBs during printing
- PCB manufacturing equipment advances
Press Releases
- Mycronic High Flex changes division name to PCB Assembly Solutions; Clemens Jargon Comments
- PRIDE Industries Invests in Kurtz Ersa POWERFLOW Wave Soldering System to Expand High-Reliability Electronics Manufacturing Capabilities
- Federal Electronics Adds AS9100 Certification to Hermosillo, Mexico Facility, Expanding Aerospace & Defense Capabilities
- SMTC Strengthens Leadership for Future Growth: Ed Smith Promoted to Executive Chairman; Mike Buseman Joins as CEO