Circuits Assembly Online Magazine - Features

Features Articles

Dr. Chris Hunt

A lack of flux or dip paste on the package can lead to post-reflow defects.

To win the deal, put preparation before price.

While there can be pockets of higher margin business, the electronics manufacturing services industry is for the most part a fairly low margin industry.

Managing a paradigm shift is much easier when the transition does not involve you.

As designers and manufacturers of advanced technology products, living day by day on the slippery slope that separates bleeding edge and commodity technology, one thing we have become pretty comfortable dealing with is paradigm shifts.

One famous journalist recently described success as “when people see you as what you wish you were.” The man who wrote that never met Ray Boissoneau (as in “boss-in-oh”).

Clive Ashmore

Two lanes on a single machine means multiple products can be built simultaneously.

Producing more boards per hour within the same line footprint is the ambition of every high-volume electronics assembly company. The more high-yield boards that can be squeezed out of the SMT line, the more profitability can be squeezed out of the bottom line.

Exposed copper coupled with silver final finish is causing opens.

Figures 1 and 2 show two images of the same problem: one x-ray, the other optical. In both cases it’s the result of sulphur corrosion on the surface of copper and silver surfaces.

Both surfaces remain exposed after a soldering operation, and in the presence of sulphur, it is possible to witness corrosion. In time it can result in an open connection, as the figures show. Figure 1, taken on a Dage x-ray system, shows different degrees of corrosion on the tracking just below the solder joint fillet. In failure investigations it’s important to see and record as much as possible without change or damage to the sample. On one joint there was an open connection on this QFP device.