White Papers

This white paper outlines some best practices around demand forecasting and material planning for distribution and manufacturing supply chains; providing tips for optimal supply chain planning so you know exactly what to buy, what to make, when, and who from.


The objective of this White Paper is to provide users of the above products in the electronics industry a clear understanding of the different types of stencil cleaning
paper/fabrics that are currently available. Fine pitch applications are more the norm now and so the performance of stencil cleaning rolls is more critical than ever before. This White Paper will give solder paste stencil printing engineers and purchasing professionals an insight into the main products on the market, thereby enabling them to make informed decisions.

Introduction: This document provides PCB designers with a set of guidelines for successful board mounting of Atmel surface mount packages. Package Land Pattern descriptions are depicted by the package family, and although each family is represented by a single body size and lead count, the individual land description apply to all packages within a particular family. Land Pattern descriptions were provided by IPC-7351 Calculator from the Mentor Graphics Corporation. These are only general guidelines that Atmel received from the IPC-7351 Calculator. The solder reflow guidelines are derived from IPC -9502. Atmel does not make direct recommendation for board design, nor does it take legal liability and responsibility for the information in this document. Please refer to the IPC website for more information regarding board design and processing.

"Water Vapor Principles"

By Gordon Davy, Ph.D.

Abstract: A discussion of relative vs. absolute humidity and diffusion into plastics.

Published March 2013


This paper tries to explain the factors that influence the ability of surface mount solid Tantalum capacitors to withstand present industry standard reflow technologies, and explores the peak temperature trends of industry IR reflow systems.


"Sequential Lamination"

by Stanley L. Bentley, Divsys

Abstract: Sequential lamination is necessary when the design of the interconnect system has connections that are not required on all layers or that if made available on all layers would impact the system performance or create an unsolvable congestion in the design.

Published May 2012

"Copper Foil Weight vs. Thickness"

by Stanley L. Bentley, Divsys

Abstract: The copper foil on the printed circuit board has two very confusing units of measure. These
units are frequently mixed and confused for one another.

Published November 2012


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