MILPITAS, CA – SEMI reported that global semiconductor equipment billings rose 11% year-over-year to $33.66 billion in the third quarter, with a 2% sequential increase driven by continued investment in leading-edge logic, DRAM and advanced packaging technologies supporting AI workloads.

Year-to-date billings have reached nearly $100 billion, marking a record pace through three quarters as manufacturers scale capacity for high-performance compute and energy-efficient architectures. Increased equipment shipments into China also contributed to third quarter momentum. SEMI president and CEO Ajit Manocha said the industry’s investment trajectory underscores the central role semiconductors play in enabling next-generation digital systems. 

• Prev
• Next