MYCenter 2.1 software improves SMT production control and efficiency. Three modules cover machine programming, data import and material handling, all unified into a redesigned single user interface that tracks thousands of parts while handling engineering changes, component deliveries and machine program revisions.

Provides a live database connection, allowing multiple users to work in parallel with real-time overviews of machine libraries. Displays nozzle size, tape pitch and width and landing pad information, ensuring correct part handling, orientation and placement. Convert bill-of-material (BoM) and Gerber data into ready-to-run machine programs. Material handling module gives real-time information on every individual reel, stick and tray. This makes it possible to track each carrier’s exact location, quantity or feeding parameters as it is used in different parts of the factory. Can be used alone or integrated into an ERP system.

Micronic Mydata, www.mydata.com

PowerFlow N2 is said to reduce lead-free wave solder operating costs as much as 90%. Features include 16" board width, plug-and-play preheat design (medium IR, convection, short IR and topside convection) and 1.8 meters of preheating. Optional preheating up to 2.4 meters can be added. New nozzle configuration brings chip wave closer to the laminar wave for reduced solder defects. Pin & chain transport throughout the fluxer and preheater. Feeds into a finger conveyor in the wave section. Bar code scanner on the new fluxer permits selective flux and programming "keep out areas" for board cut-outs, where the fluxer will not spray a specific are of the board. Process gas cleaning system (similar to reflow machines) regulates tunnel temperature compensation. Low profile (1.57m) design.

Ersa, www.ersa.com

HTCX (Heat Transfer Compound Xtra) silicone-free thermal paste includes a dispersant in the formulation that reportedly increases thermally conductivity without increasing film thickness. Is smoother and provides higher thermal conductivity, lower oil bleed and lower evaporation weight loss. Is said to be humidity- and thermal cycling-resistant. For thermal coupling electrical and electronic components, and between surfaces for thermal conductivity and heat dissipation.

Electrolube, www.electrolube.com

Thermoset SC-303, SC-309 and SC-320 thermally conductive silicone encapsulants are designed for thermal conductivity for electrical/electronic encapsulating applications. Are two-component systems designed to retain properties associated with silicones. Exhibit low shrinkage and stress on components as they cure, and maintain low viscosity. Are environmentally resistant and UL-rated; are composed of an addition-curing polydimethyl siloxane polymer that will not depolymerize when heated in confined spaces.

Lord Corp., www.lord.com/electronicmaterials

Selective Stamp Soldering involves fitting a selective soldering machine with a custom stamp soldering nozzle with several aperture indexes around from board to board. Stamp solders small patterns on each printed circuit board. Is reportedly faster than a single nozzle selective soldering routine. Reportedly requires no modifications to selective soldering machine. Nozzle can be removed and exchanged with a standard nozzle. Processes every board in the panel in the same fashion. Has a small multi-port nozzle. A small pattern involving a connector and three other devices takes about 6 to 7 sec.

ACE Production Technologies, www.ace-protech.com

PVA710 dispenses optical bonding adhesives and assembles optical devices in atmosphere without bubbles. For use with optically clear acrylics or silicones. Provides dam and seal dispensing and curing, fill dispensing and cover placement. Applications include bonding touchscreen to LCD, cover glass to LCD, etc. Employs a gantry system featuring precision ball screw slides driven by brushless DC servo motors. Every axis of motion features optical encoder feedback. The cover glass trunnion provides an assembly means where the bonded surface is not contacted by the system. Accommodates panels up to 17" at 16:9.

PVA, www.pva.net

EVS 8K LFHS lead-free solder recovery system features improved thermal efficiency, ease of operation, maintenance and environmental management. New software is said to increase solder recovery rates 15 to 20%. "No hinges" door provides greater, easier access when performing cleaning. Loading tray improved. High solids filtration system increases air flow and dust/smoke capture. Comes with LED monitor to indicate filter changes.

EVS International, www.solderrecovery.com

AutoVISION 2.0 machine vision software provides additional capabilities, including verification and OCV (optical character verification) tools to validate print quality, a logic tool for building pass/fail criteria, and support for automated job changeover. Features Microscan Link for connectivity to PLCs and other industrial control systems. Supports Vision Mini and Vision Hawk smart cameras. Has compact, fully integrated or C-Mount designs. Can be upgraded to Visionscape platform.

Microscan, www.microscan.com

SL Feeder has an automatic tape feeding supply that is said to be fast and splicing-free. No need to collect cover tape, and reduces impact caused by electrostatic and dust

Hitachi High-Technologies, http://hht-eu.com

LJ-V7000 high-speed 3D laser scanner scans areas as wide as 240mm and has a Z-axis repeatability as high as 0.4µm. Incorporates HSE3 CMOS receivers. Imaging sensors permit profile sampling rate of 64 kHz with a point sampling rate of 12.8 MHz. Includes USB and RS-232 outputs; can export profile data over a TCP/IP Ethernet interface at full acquisition speeds. Ethernet/IP communications option available. Provides analog data or judgment outputs using onboard 2D and 3D data processing capability.

Keyence, www.keyence.com

PC-TF16-24 hyQ feeder is for Paraquda and Cobra pick-and-place machines. Can be used for 16mm and 24mm tape widths. Placement machine can detect is automatically. Feeders can be exchanged during production. Automatically threads tape and cover tape. Integrated tape pull-back system prevents jamming. Both 7" and 13" reels can be installed; pocket depth can be up to 13mm. Has feeding time of 60ms for 4mm.

Essemtec, www.essemtec.com

Radial 88HT and VCD 88HT through-hole component mounters have expanded component ranges and come as upgrades for existing Gen. 8 and 88 machines. Reportedly provide twice the throughput of older AI equipment. Radial 88HT accommodates largest range of components on a single machine with quad-span insertion tooling (2.5mm, 5mm, 7.5mm, and 10mm); addresses high-density applications with single-span insertion tooling. Has a programmable clinch height. With an available Tall Part Kit, it places components as tall as 27mm. Includes easy-load dispense heads, 100+ feeder locations, and a component verification system that validates product setups. Is suited for LED, compact fluorescent, and energy-efficient lighting products.

Universal Instruments, www.uic.com