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IPC Apex Expo 2013 New Products

SCC conformal coat protects printed circuit boards from liquids, salts and other corrosive elements. Seals over, in and around all the elements on the board or device at a nano level. Protect PCBs against water, IPA, mixed salts, and other corrosive elements. Applied using a plasma process. Permits rework without masking or laser ablation.

Semblant, www.semblant.com

 

PS588 component programmer now comes with a second-generation 3D coplanarity vision system. After a device is programmed, the 3D vision system measures the leads of each device to ensure they are within specified tolerances before placed in output media. Reportedly drives down risk of product failures caused by manufacturing and handling defects. Measures x, y and z axes of the leads on a device to proof them against set acceptance specifications and criteria.

Data I/O, www.dataio.com

Inspex HD Vesa/Inspex HD Table high-definition camera inspection system offers HD image quality and magnification, color reproduction, contrast and resolution. Is said to reduce false rejects from an AOI system.

Ash Technologies Ltd., www.ashlowvision.com

NanoClear stencil treatment uses self-assembled monolayers with phosphonates (SAMP) said to be compatible with all common types of stencil alloys, including stainless steel, electroform, nickel, and e-polished stencils. Is less than 5nm thick and covalently bound to the surface, eliminating risk of contamination of the flux. Enhances stencils performance. Applied via a wipe.

Aculon, www.aculon.com/stencils.php

SL automatic self‐loading 8mm feeder provides splice‐free continuous operation. Permits addition of a secondary reel supply in the same feeder at any time during operation, reducing or eliminating unnecessary material costs. Accepts strip‐tapes. Reportedly can be loaded in 10 sec. or less. Uses a new cover tape process that mitigates release of dust and debris inside the placement system. Is backwards compatible with entire line of Hitachi modular mounters back to the GXH‐1.

Hitachi High Technologies America, www.hitachi‐hta.com

 

 

 

IS-I-700 inline selective soldering system handles boards up to 700 x 700 mm (27.6 x 27.6"). Features SMEMA pass-through conveyor. ach solder pot comes with inert hot nitrogen atmosphere feature. Comes with micro jet fluxer for clean soldering results and low flux consumption. Optional large top and bottom side preheating system, controlled by pyrometer.

InterSelect, www.myInterSelect.de

IS-I-460 inline selective soldering system handles boards up to 460 x 460 mm (18 x 18"). Features SMEMA pass-through conveyor. ach solder pot comes with inert hot nitrogen atmosphere feature. Comes with micro jet fluxer for clean soldering results and low flux consumption. Optional large top and bottom side preheating system, controlled by pyrometer.

InterSelect, www.myInterSelect.de

ERO-500 reflow oven has five top and five bottom vertical heating zones, and one cooling zone. Uses plenum convection heating for uniform temperature profiling across the entire printed circuit board. Maximum temperature of 320°C. Compatible with most lead and lead-free solder paste profiles. For low- to medium-volume production runs. Status light tower included. Mesh belt or edge rail conveyor units available. Real-time graphic temperature profiler.

DDM Novastar, ddmnovastar.com

FuzionXC2-37 and FuzionXC2-60 reportedly have more than twice the feeder inputs of other surface mount machines. Have NPI software tools featuring icon-driven interface and efficiency tools, including online component auto-teach and on-the-fly production editing. Ion feeders have top-loading design that reportedly reduces replenishment and changeover times by 50%. Combine high-speed chip to odd-form placements – from 01005 passive components up to 150mm connectors – with 5kg placement force and parts up to 25mm tall. FuzionXC2-37 accommodates boards up to 1300mm x 610mm, 272 8mm feeder inputs, and input types including strip, tape, tube, odd-form, and tray. The FuzionXC2-60 has 264 8mm feeder inputs.

Universal Instruments, www.uic.com

RO-Control and RO-Soft 7 software simulate, control and document RO300 and RO400 series reflow and curing ovens and processes. RO-Control 7 controls and regulates oven parameters such as zone temperatures, feed rate and conveyor width. Automatically set up certain ovens and start production. Status messages displayed graphically, and incoming and outgoing boards are monitored. Auto-save feature regularly captures temperature and speed values in a CSV type file. Operator actions are logged, and software modules can be released to specific individuals. Based on temperature settings, product data and throughput expectations, RO-Control simulates expected temperature profile, and graphically compares to measured values and solder paste specifications. Both packages measure real temperature profiles directly on the PCB using thermocouples. Multiple measurements can be overlaid to detect deviations. All data can be exported as CSV and graphics. Both packages require Windows 7 and can be upgraded from older versions. Language support now includes Polish.

Essemtec, www.essemtec.com 

VT-X700 inline, automated 3D CT x-ray analyzes printed circuit boards, including those with hidden solder joints. Inspects solder quality on components from BGAs to chips, and through-hole devices. Inspections are performed at 5 sec. per field-of-view. Gauges PCB surface for each solder joint, compensating for warpage; performs cross-sectional analysis at slice-level locations. Has selectable resolutions of 10, 15, 20, 25 or 30µm combined with selectable numbers of x-ray projections (up to 128).

Omron, www.omron247.com/
 

VT-S500 has 3D image processing; analyzes topographical features of solder fillets. Is capable of performing solder inspections that mimic IPC guidelines. Software is capable of absorbing production inconsistencies and noise. Provides high-speed inspections and has dual-lane availability. Is available with camera magnifications of 10 or 15µm; is capable of processing PCBs up to 510 x 610mm (single-lane applications) or 510 x 300mm (dual-lane applications).

Omron, www.omron247.com/

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