Loctite UF3810 underfill reportedly provides high reliability, while permitting easier reworkability. Is halogen-free, completely reworkable, and has a glass transition temperature (Tg) of 100°C, delivering thermal cycling reliability for wafer-level CSP and PoP devices. Is suited for handheld communication and entertainment applications. Delivers drop and shock protection and improved thermal cycling reliability for fine-pitch (0.5mm pitch and below) area array devices. Cures quickly at 130°C.

Henkel, www.henkel.com/electronics  

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