Circuits Assembly Online Magazine - Practical Components Supplies AIM’s Print Test Board and Kit

Practical Components now supplies the AIM print test board and kit designed to include printing challenges commonly encountered on manufacturers’ assemblies. In addition to BGA and microBGA pads, both have circular and square pad designs to test paste release. AIM has included the standard IPC slump test pattern to further challenge the properties of any product tested. This print pattern is more “real life” and can more accurately predict slump since individual pads are used as opposed to one pad that is common in the “thermometer” method. A number on the board indicates the distances between pads.

Common pad sizes were incorporated into the layout including 1206, 0805, 0402 and 0201 rectangular pads for discrete components. These pads have varying distances between them, allowing users to determine paste solder beading. Four 250 x 250 mil pads are available for use with various aperture styles to allow for wetting tests. There are also several fine-pitch QFP pads designed to check for the propensity of any given product to cause bridging, and to confirm the existence of torn prints, peaking (dog ears) or bridging.

Board material is FR4 170Tg with a standard ImAg finish. Digitized Gerber files are provided by Aegis Software. Available with lead-free components.

Practical Components, practicalcomponents.com