Three new UV-cure encapsulants for use in Smart Card IC module manufacturing are now available: Hysol 3323, Hysol 3327 and Hysol 3329. Developed using single-component epoxy technology, they reportedly provide faster curing times, improved adhesion, minimized tape warpage and excellent performance during reliability testing, compared to existing UV- or thermal-cure encapsulants.

Designed specifically for the encapsulation of wire-bonded dies used in Smart Card ICs. Hysol 3323 has high viscosity and a thixotropic nature, and is used to form the dam, while Hysol 3327 and 3329 are low viscosity materials used for the fill process. 3329 has a higher T_g of 155°C (compared to 110°C for Hysol 3327) and a higher Shore hardness.

Are easy to dispense, adhere strongly to a range of carrier substrates and possess a low coefficient of thermal expansion (45ppm below T_g and 130ppm above T_g). Typical UV cure times per IC module are 26 to 46 sec., which enables a maximum of 10,000 UPH.

Henkel, henkelelectronics.com

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