Report: Lead-Frame Package Shipments to Grow 4.3% by 2021
AUSTIN, TX – Power devices are experiencing growth, with overall lead-frame package shipments expected to increase 4.3% from 2017 to 2021, with stronger growth projected for Cu clip packages, according to TechSearch International.
Applications including energy generation and infrastructure, electric and hybrid vehicles, electric vehicle charging, data centers, industrial automation, smart cities and buildings, home appliances, and transportation are driving demand for power devices, says the firm.
While many companies continue to expand production of silicon-based power devices, the need for increased power density and system efficiency is driving demand for devices based on new wide band gap materials such as silicon carbide (SiC) and gallium nitride (GaN). The ramp of WBG devices will push operating junction temperatures to 200°C and beyond and require new materials and assembly processes to deliver the necessary thermal and high current-carrying performance.
