Products
A new phase change tape extends the line of Thermacool thermal management products for the computer assembly market. Provides high thermal transfer between microelectronic components on circuit boards and heat sinks, allowing the replacement of thermal grease in rapid microelectronic assembly operations.
Available in many customized die cut formats for a range of applications.
The new line of phase change products include:
- C1055, with very high thermal conductivity; has been specified in many high performance processor applications.
- C1060, which has an integral reinforcement to provide more robust handling.
- C1095X01 thermally conductive polymeric interface material designed to avoid bondline adhesion between heat sink and the microprocessor metal surface for rework.
- C1100 phase change compound with room temperature self-adhering-properties and improved heat transfer that is said to rival the best thermal grease.
DEK 248 semi-automatic printers have a new PC-based user interface, allowing operators to view all machine parameters at a glance. A new keyboard features integrated trackball. Has integrated support for Simplified Chinese, Korean and Japanese. A 3.5-inch floppy disk drive is included.
Supports optional vision capabilities. Vision setup features are fully integrated, real-time image data is displayed on-screen. Vision information of the product is saved automatically with the product file.
The new UI resembles the interface available for DEK's high-end fully automatic platforms, enhancing commonality between machines in the range.
ALPHA OM-325 lead-free solder is said to simplify the transition to µ-fine feature printing in lead-free processes. Reportedly offers excellent print transfer efficiency, self-alignment properties with small components down to 0402 or 01005", joint cosmetics across challenging reflow profiles, low voiding performance and product stability.
"We developed ALPHA OM-325 in our Japanese R&D center in collaboration with leading global adaptors of lead-free technology for use in their high end consumer electronics products," said Valentijn Van Velthoven, global product manager. "Our rigorous product development work for OM-325 can be compared to what Formula One technology means for the automotive industry. We have achieved tomorrow's technology, and made it available today."
Made with Type 4 and 5 powder, the paste delivers excellent µ-fine feature print yield and works well in demanding high-soak reflow profiles.
PELASPAN-PAC Anti-Static provides cushioning for a range of electronic parts and components to protect them from static discharge during shipment. The pink, s-shaped polystyrene material is free-flowing, cutting packaging time. Weighs 5 pounds per cubic foot - 15% lighter than comparable varieties of packing peanuts. Reusable, recyclable and part of a nationwide reuse program to lessen the loose-fill sent to landfills each year.
Available from 20 facilities nationwide.
FLX2010 SMD pick-and-place has 190 feeders, allowing feeder changeover during operation with nearly no downtime. Can place 5,000 components per hour.
Precision drive technology places 0201 or ultra-fine pitch 0.3 mm components, as well as condensators up to 15 mm, large connectors and 50-mm BGAs. Features both laser and vision centering systems for speed and accuracy.
Feeder management system automatically recognizes feeders and pickup height. LEDs show the feeder status. Feeder setup control system based on barcode identification excludes the risk of setup failure.
Machine programming can be prepared offline. CAD data can be imported; the board is graphically displayed before production.
Optional software system features stock management, production planning, simulation and data recording for traceability.
Can be expanded to a two- or three-module production line for more feeder capacity (up to 300 feeders) and production speed (up to 15,000 cph).
Using Laser-Microjet technology, the LS 800F cuts from 1 to 10 holes per second (or 36,000 apertures per hour), reportedly without any heat damage, burrs or oxidation.
Uses a fiber laser source uniquely suited for thin, high precision stencils and masks.
Fiber lasers have high pulse-to-pulse stability, are compact, ensure efficiency, are robust, have low consumption of electrical power and are maintenance-free. They do not necessitate any alignment, cleaning or servicing of optical parts. Does not require any lamp or diode exchanges. Diode lifetime surpasses 100,000 hours.
The fiber lasers emit pulses at a repetition rate between 20 and 50 kHz, with a pulse duration measured in nanoseconds. Said to offer a fine cut, higher cutting speed and a higher accuracy than conventional laser sources. 100um fiber core diameter enables users to apply water jets below 30 um.
Synova S.A. (Ecublens, Switzerland)
RemoteTech remote diagnostics service allows Speedline's support center to remotely diagnose and solve customer equipment and application problems.
Customers can expect improved troubleshooting and problem solving over the Internet and telephone, minimizing field service visits, cutting mean time to repair, lowering maintenance costs and reducing staff technical training.
The secure service allows Speedline to access equipment recipe files and error logs, facilitating software upgrade uploading.
The diagnostic services are available for most of Speedline's products currently in production. The customer's equipment must have an Ethernet card or modem, be connected to the Internet and use Microsoft Windows.
The services will be free of charge during the equipment's warranty period and will be included in the company's Protection Plus service contract. Can be purchased on a per-machine basis.
Indium3.1 water-soluble Pb-free solder paste is formulated for fine-pitch applications. The company claims the long stencil life virtually eliminates solder paste waste.
Said to exhibit excellent wetting under both air and nitrogen reflow atmosphere. Residue is easily cleaned with water.
Features a wide reflow window, slump resistance, low voiding and low foaming.
MX-Series SMT assembly systems are for medium- to high-volume operations. They feature real time vacuum monitoring prompts the operator (without stopping the machine), when a job is loaded and when running. When it detects the vacuum threshold in the heads is low, it also alerts the operator. Each feeder, in addition to storing part number, lot code and feeder pitch, carries its presentation performance forever.
The series consists of two systems, MX-310 and MX-240. Features include:
- Placement accuracy of 33 µm at 4-sigma accuracy for QFPs, BGAs and CSPs.
- A line scan camera inspects large parts and odd-form.
- A coplanarity checker inspects parts for pre-placement lead warpage.
- Improved illumination on all systems allows for more LEDs (both collimated and oblique), resulting in improved recognition of the full component range.
- Light settings invoked for each part, preventing machine stoppages from "false failures" due to non-uniform lighting.
- A flip-chip camera, for processing FC devices.
Also, the MX-310 has a four stage transport system that enables 25% more speed when processing 8" x 12" boards; a head mounted servo driver/motion controller that permits machines to run at higher speeds through faster response times and eliminates 75% of the cabling from the head to the bottom chassis.
The MX-240 has a closed-loop force control head to minimize impact force. These spindle-mounted sensors operate in concert with high-response vacuum control for force control; a high-speed tray presentation, a side-mounted P40TSU (40-tray shuttle unit) that presents tray fed components without limiting feeder space or board size; and can be configured with two units, which allows 170 unique part numbers to be held per machine.
Tyco Electronics will premiere the Mirae MX-Series at Assembly Technology Expo, Sept. 26-30, 2004.
http://automation.tycoelectronics.com
3M Wafer Support System for ultra-thin semiconductor wafer backgrinding is an alternative to conventional tape processes and is capable of producing wafers as thin as 20 microns. Permits manufacturers to use existing grinding equipment to produce thinner wafers, at faster grinding speeds, with increased yields. Includes both equipment and consumables for a comprehensive approach to wafer backgrinding support challenges.
Features include:
- A wafer mounter to attach the wafer to the glass plate with liquid adhesive.
- A wafer demounter to separate the glass and adhesive from the wafer after the backgrinding process.
- A glass cleaner/coater.
Consumable materials include 3M ultra-clean UV curable spin-on adhesive and a light-to-heat conversion coating. The LTHC layer enables separation of the adhesive from the glass after the backgrinding process.
Unlike tapes used in other systems, the liquid adhesive used in the 3M system flows into the topography of the wafer, providing even support over the entire surface and providing a rigid, uniform base. The system minimizes stress put on the wafer, resulting in less cracking and increased yields.
KIC announces new software for its SlimKIC 2000 oven.
Features include:
- Temperature vs. time feature, for profiling a variety of processes. Allows running of profiles and and experiments for practically any thermal process (batch processes for cure, environmental temperature cycling, rework, high-temperature processes and more).
- Measures temperatures from -150º to 1,050ºF.
- Permits use of SlimKIC 2000 over a broader range of applications.
- User-defined process window; software calculates PWI .
The software is free of charge on the machine.
KIC provides thermal process development and control software.
www.kicthermal.com
Bliss chip tube carts are ergonomically designed for convenient chip tube storage and easy positioning. Constructed of steel, the carts incorporate four bin rows that can be subdivided on ½" centers. Using available slide-in dividers, the rows can be configured into various sizes. The presentation angle of the storage bins can be adjusted for operator comfort and for ease of access during manual component assembly. Gas lift springs assist in raising and lowering the unit.
Standard features of the carts include:
- Built-in ESD protection.
- Adjustable bin size.
- Ergonomically correct.
- Easily adjustable height via gas springs.
- Easily adjustable tilt.
Press Releases
- SMTXTRA Partners with Quantum Systems to Expand Representation in Key Territories
- KYZEN Announces Exclusive Partnership with Manufacturers’ Representative Restronics Florida
- Koh Young will Showcase its Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225 on 11-13 June 2024 in Nuremberg, Germany
- Precision Automation & Assembly Appointed as New England Rep for Kubler US