Circuits Assembly Online Magazine - News

Products

Multicore LF318 is a halide-free, no-clean, pin-testable, lead-free solder paste that promises broad process windows for printing and reflow. Developed to appeal to multinational manufacturers wishing to qualify a single solder paste with reliable, repeatable performance within the assembly environment.

Reportedly achieves a high degree of coalescence upon reflow even after 72 hours at 27° C and 80% RH, and in testing to IPC ANSI/J-STD-005 and JIS-Z-3284 standards displays excellent resistance to slump. Has low paste wastage - the result of superior tack life and an open time greater than 24 hr. - and resistance to component movement during high-speed placement, through its high initial tack force of 2.0g/mm².Suitable for reflow in air or nitrogen, said to display excellent solderability on a range of surface finishes, including Ni/Au, immersion Sn, immersion Ag and OSP copper. Soft, non-stick, colourless residues remain after reflow, easing visual inspection and permitting reliable in-circuit testing.

Available in lead-free alloys 96SC (SAC387) and 97SC (SAC305, and a tin-lead version.

Henkel, henkel.com

SemiTouch, a semiautomatic stencil/screen printer is engineered for precision and consistency in paste deposition. Offers a self-diagnostic program for instant troubleshooting.

Has print area of 16 x 20", offers double squeegee assembly and multiple print modes. Includes servo programmable squeegee speed and positions; controlled vertical stencil lift; last board recall; an infinite board storage library; interchangeable squeegee heads; runtime diagnostics; programmable snap off delay, squeegee up delay and squeegee offset; floating or fixed squeegee holders; and more.

Registration repeatability is ±0.005", with stencil separation gap range of 0.5" and a squeegee pressure of 1 to 65 psi.

Milara Inc., milarasmt.com

BOLTON, MA, Jan. 10 -- DownStream Technologies will release the latest revision of its PCB CAM software next month, the company said today.

CAM350 v. 8.7 will include modules for Fast Array and ODB++ Import. All mid-range and high-end configurations will include the ODB++ Export module.

Company officials cited a growing demand by mainstream PCB designers for new alternatives to Gerber and greater functionality to array PCBs.

Fast Array automates the sub-panel process to quickly array a PCB or a group of PCBs on a panel, feeding the fabrication and assembly process. The bidirectional ODB++ format permits easy import and export of symbols, step and repeat, components and drills.

"We have continued to see the mainstream market become increasingly conscious of how PCB design impacts PCB manufacturing," said Rick Almeida, founder of DownStream (www.downstreamtech.com), in a press statement. "With release 8.7, we are delivering what used to be 'exclusive' technology with virtually every new product we ship. This will allow our customers to design the most manufacturable PCBs they can."

The new release also supports Altium's PCAD 2004 and the next product update of Mentor's PADS PCB layout software, and has a number of other software corrections.

The release comes at no additional charge to all existing customers with a valid maintenance agreement. The update will be available in February.

In a press statement, the company said it plans "several other important" announcements for PCB design this year.

Version 8.7 of the CAM 350 PCB CAM solution makes what was once "optional Functionality" standard in their entry-level Gerber analysis and editing configurations. Includes Fast Array and ODB++ Import and Export modules. Bidirectional ODB++ format allows for easy import and/or export including symbols, step and repeat, components and drills.

Supports Altium's PCAD 2004 and the next product update of Mentor's PADS PCB layout software, as well as other software corrections. The company expects to ship the Fast Array and ODB++ Interface modules to over 4000 existing customers.

DownStream Technologies, downstreamtech.com

Surftest SV-800 surface roughness measuring machine is engineered around a column-moving mechanism that virtually eliminates load capacity limitations. The large measuring envelope (800 X 500 X 200 mm) and long-stroke probe arm accommodate sizable, heavy workpieces such as crankshafts and camshafts as well as other powertrain, engine and similar components. The long reach of the probe arm can measure multiple cross sections and waviness over a wide range.

Constructed to attenuate vibration and minimize measurement deviations attributable to machine deflection. SURFPAK software provides straightness compensation, which improves the linear accuracy of the x-axis; circular compensation, which enhances accuracy related to vertical movement of the stylus; and stylus-tip diameter wear compensation.

Mitutoyo America Corp., mitutoyo.com

Effective January 1, KIC 24/7 continuous thermal process monitoring and traceability system ships standard with KIC Navigator process development and optimization software.

Prior to beginning production, the software selects the oven recipe that positions the thermal process towards the center of the narrow process window. This ensures a stable process while accommodating the natural process drift that exists in any process. It avoids the frequent alarm syndrome caused by a poorly developed initial processes teetering on the edge of the process window. Operates in real-time to warn of an out of control process, and immediately alarms on an out-of-spec situation.

KIC, kicthermal.com

Micro-Lite FL-1000 and FV-1000 ring lights for microscopes now feature full spectrum lighting (FSL) bulbs at no extra charge. FSL contains the entire range of visible wavelengths, so all objects and a wide range of materials can be seen. FSL is critical for lead-free solder connections inspection.

The FL-1000 fluorescent ring illuminator features advanced electronic ballast for control and stability, and dimmable intensity without flickering or humming. The FV1000 offers full intensity variability due to its patented microchip-controlled, dimmable fluorescent technology. Operators can adjust the lighting to their own comfort level. Both are ESD-safe and offer a pluggable bulb design for replacement.

Micro-Lite, micro-lite.com

Three new UV-cure encapsulants for use in Smart Card IC module manufacturing are now available: Hysol 3323, Hysol 3327 and Hysol 3329. Developed using single-component epoxy technology, they reportedly provide faster curing times, improved adhesion, minimized tape warpage and excellent performance during reliability testing, compared to existing UV- or thermal-cure encapsulants.

Designed specifically for the encapsulation of wire-bonded dies used in Smart Card ICs. Hysol 3323 has high viscosity and a thixotropic nature, and is used to form the dam, while Hysol 3327 and 3329 are low viscosity materials used for the fill process. 3329 has a higher T_g of 155°C (compared to 110°C for Hysol 3327) and a higher Shore hardness.

Are easy to dispense, adhere strongly to a range of carrier substrates and possess a low coefficient of thermal expansion (45ppm below T_g and 130ppm above T_g). Typical UV cure times per IC module are 26 to 46 sec., which enables a maximum of 10,000 UPH.

Henkel, henkelelectronics.com

LDS9000 mechanical dispensing system is a fully programmable, electric powered and mechanically operated system that is air-free.

Features an easy-to-program control unit and a hand-held dispensing gun that employs a precise, linear actuator-driven piston to push a fluid or adhesive through a plastic syringe. Permits repeatable shots, runs on 115 VAC and eliminates the problems associated with conventional air dispensers such as variations in pressure, moisture and fluid viscosity.

Suitable for in-plant assembly and field maintenance, has a microprocessor-based portable control unit, a foot or hand operated pedal, and gun stand. The software-driven unit knows the I.D. of the syringe, dispense rate and required volume; calculates the precise distance the piston needs to travel. It also draws back to prevent oozing.

Fishman Corp., fishmancorp.com

Version 5 of the Web-based Flopack software enables the creation of Delphi compact models that predict the performance of electronic components under soon-to-be-published thermal testing standards from JEDEC committee JC-15.1. Produces behavioral compact models that can predict the temperature of component packages at critical points such as the junction, case and board. New features include a faster, more accurate nonlinear optimizer, support for additional nodes, user access to setup parameters and the ability to create compact models from non-Flomerics simulation data.

Consists of a collection of "Smart Part" modules installed on a central web server. Users enter data describing the IC package through simple forms using a standard Web browser.

An advanced nonlinear optimization method reportedly provides more accurate Delphi compact models. The new algorithm automatically optimizes the area assigned to each node, eliminating the need for manual nodal partitioning. Provides a more flexible objective function that combines flux and junction temperature contributions. In addition to the top inner/outer and bottom inner/outer nodes supported in the past, the new version also supports up to two side nodes for all packages and up to four lead nodes for leaded packages.

Flomerics, flomerics.com

FKI Logistex has added new features to its 2100 and 2200 series vertical carousels to cater to the SMT, pharmaceutical and automotive dealership industries.

Designed to promote ergonomics, security and safety, the high-throughput capacities and small footprints of the 2100 and 2200 carousels are ideal for high-density small item storage and retrieval solutions.

For the SMT market, the company has added a 19-in. pitch to the 2200 series. The new pitch allows both 7 and 14 in. standard reels to be stored in the same unit. Also has a removable intermediate shelf to enable customization and offers various ESD totes and storage media to maximize unit capacity.

In the semiconductor industry, FKI Logistex will offer an automated variation of the 2100 series, designed to accommodate clean room standards up to Class 1.

Other new features include an upgraded standard keypad controller that allows the operator to key in the pan number for product retrieval and the ability to upgrade the units for software control.

FKI Logistex North America, fkilogistex.com

Full spectrum lighting (FSL), a critical feature for lead-free assembly and inspection applications, is now supplied free of charge on all illuminated magnifier products. Full spectrum light contains the entire range of visible wavelengths, so that the human eye can see all objects and a range of materials; helps to inspect lead-free solder connections.

According to president Richard May, "Lead-free solder connections are not smooth and shiny like those of lead-bearing solders; they are rough, irregular and frosty-looking. This surface appearance makes it even more difficult to see microscopic cracks, voids and defects in a solder joint, or to judge between an acceptable defect level and an unacceptable one. Full Spectrum Lighting gives the inspector or assembler a critical edge in working with lead-free connections, adding enhanced visibility to duller and rougher lead-free alloys so that effective inspection can be accomplished."

The O.C. White Co., ocwhite.com