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FEINFOCUS Graphical User Interface (FGUI) software version 2.2 offers real-time background subtraction. Background subtraction reduces shading in x-ray imagery, a common problem in x-ray inspection that limits image contrast.

Shading appears as a slight fading of intensity from the image center toward the periphery, the degree of which depends largely on the sample or structure being x-rayed. The FGUI enables users to activate an automatic background subtraction process, loading a previously produced background image from one of the many buffers available. The gray values of the background image are automatically subtracted from those of the active x-ray image in real-time -optimizing image contrast and facilitating interpretation of the inspection results.

The inspection software has several new capabilities, including an AVI recorder, 16-bit image processing, seamless integration of Direct Digital Detectors (DDD) and image saving in a variety of formats (e.g. TIF, BMP and JPG). New image-processing operators have also been added, such as an electronic film operator.

FEINFOCUS, feinfocus.com

Squeegees now available with the entire blade coated with Permalex. Reportedly reduces solder paste sticking. Infuses the blade with a polymer lubricant, developed through a multi-step metallurgical bonding process. Said to reduce stencil pulling and stretching, improving pad registration and stencil life.

Transition Automation Inc., transitionautomation.com

Agilent Technologies' automated test solution for functional, at-speed test reduces the cost of testing high-speed, system-on-a-chip (SOC) devices. Part of the 93000 SOC Series, the high-speed I/O solution enables functional testing of high-pin-count devices, such as next-generation PC chipsets up to speeds of 3.6 Gb/s.

Enabled by the Pin Scale 3600 Digital Card, offers per-pin scalability from 800 Mb/s to 3.6 Gb/s. High-speed SOC devices are widely used in computer, digital consumer, communications and networking products.

Each pin offers both single-ended and differential I/O test capabilities to test a range of interfaces including DDR, G-DDR, PCI Express, S-ATA, HyperTransport and Front Side Bus (FSB). The automated test equipment can be matched to the device through software scaling, pin by pin.

Features a test processor per-pin architecture, which localizes all test processing, resulting in minimal measurement overhead and higher throughput. Delivers a differential pin edge placement accuracy (EPA) of better than ±30 ps.

With up to eight independent clock domains, can satisfy timing needs for concurrent at-speed testing of multiple buses running at non-friendly speed ratios (bus fractions).

Available in various data-rate, memory and pin-count configurations.

Agilent Technologies Inc., agilent.com

Built in rugged stainless steel and fully rated for product washdown, the Stainless Steel Conveyor meets the needs of food, beverage, and consumer goods manufacturers.

Has side frames built in 304 polished stainless steel; all fabricated parts available in stainless steel. Can be wet-cleaned after production runs. Corrosion-resistant construction reduces wear and tear and extends conveyor component life.

Expands on the company's rollerless conveying system, offering styles for zero-pressure accumulation, transportation, incline, decline and metering. Uses a modular plastic-belt conveying surface, eliminating the need for rollers and providing a continuous surface for product conveying. The belted surface also decreases the number of moving parts, simplifying maintenance, installation and start-up.

Operates at speeds up to 300 ft/min., has a live load weight capacity of 70 lb./ft and can convey a variety of items, from shrink-wrapped packages to corrugated boxes.

FKI Logistex, fkilogistex.com

T612M-DS double-sided thermal transfer printer can simultaneously print on the front and back of the marker. Offerscost savings through halved print time and reduced waste.

Can process all TMS SYSTEM SIX heat-shrinkable markers, from 2.4 to 57.2 mm.

Rated for heavy-duty cycles, incorporates a 300-dpi (12-dpmm) print head. The printer-marker system is also suitable for general-purpose, high-volume industrial use.

The data printed onto the two sides of each marker can be identical, different, same-side up or flipped. Offers nominal print speeds of 50 to 128 mm/second and is available in English, French, German, Italian or Spanish language configurations.

Tyco Electronics, tycoelectronics.com

The In-Sight 5100C color vision sensor performs a range of color inspection tasks in a number of major industries. Can be used in the electronics industry to verify the correct position of color LEDs at electrical test stations. In-Sight 5101 is a high-resolution (1024 x 768) industrial-grade vision sensor for high-accuracy gauging applications that require increased resolution for inspecting small objects, or capturing images of larger parts.

The self-contained vision sensors meet IEC specifications for shock and vibration, and achieve an IP67 (NEMA 6) rating for dust and wash-down protection - without the need for a separate industrial enclosure. Include vision spreadsheet interface and software to simplify application development and network administration.

Cognex Corp., cognex.com

The DEK Instinctiv user interface acts as the portal to technical support services via the Internet and is now available on the Micron-class Galaxy and Europa platforms.

The UI draws on human factors techniques to display complex machine and process data in an easily digestible form. Features advanced graphical techniques, real-time indication of consumables levels and extensive on-board help and error recovery.

Using wireless broadband connectivity across the shop floor, combined with up to the minute security features including Internet firewall and Wireless Encryption Protocol (WEP), Micron-class machines can now be connected to DEK knowledge servers via IPsec VPN tunnel technology without requiring extra cabling.

www.dek.com

PALO ALTO, CA-- Agilent Technologies Inc. (agilent.com) has developed bead probe methodology for in-circuit test of high-speed and high-density printed circuit boards (PCBs). Bead probe technology addresses the needs of electronics contract manufacturers for accurate testing of increasingly complex PCBs, such as those used in communications and computing.

As board circuitry gets smaller, traditional bed-of-nails test solutions become problematic. Because on-board test target sizes are shrinking, this approach is no longer capable of reliably contacting hyper-small test targets, which have an unacceptable performance impact on high-frequency signals. Likewise, boundary-scan cannot solve this problem because it does not offer 100% coverage of defects.

Bead probe technology circumvents these issues by placing very small, hemi-ellipsoid beads of solder directly onto a board's copper traces. A bead probe, only a few mils tall, protrudes above the solder mask. When partially flattened by a fixture-based, flat-faced target probe, it gives low-contact resistance needed for testing.

Bead probes are easily fabricated, using the same steps as solder masking/stenciling.

"Bead probes are particularly well suited for highly dense layouts or gigabit signals and, according to our tests, have a negligible impact on circuit performance during normal operation," said Kenneth Parker, engineer/scientist for Agilent's Electronic Manufacturing Test Division. "Bead probes let us approach an ideal of layout-independent, test-point placement -- a great benefit in high-density, high-frequency design that will revolutionize the normally adversarial relationship between board designers and test engineers."

Currently being tested by Agilent's high-volume manufacturing partner, full licensing of the technology is expected to be available by mid-2005.

SwifTest-AQ ("Active Quality") software features real-time parts average testing (PAT) capabilities, designed to enable IC manufacturers to meet increasing safety standards and specifications for automotive electronics.

Performs PAT in real-time by calculating PAT limits from baseline data and binning out PAT outliers in real time, avoiding post-processing and subsequent delays in wafer processing.

Industry guidelines for semiconductor quality and reliability have been developed by the Automotive Electronics Council (AEC) to meet increasing safety standards for automotive electronic devices that drive the zero-defect goal for electronic parts.

Meets AEC-Q001 Part Average Testing standards during both wafer probe and final test. The AEC guideline presents a statistically based method for removing parts with abnormal characteristics— those parts that historically contribute significantly to

quality and reliability problems.

Jeff Bibbee, founder and CTO of Pintail Technologies, said, "Instead of post-processing large data files from all testers before calculating the PAT limits from the entire dataset for each test, SwifTest-AQ customers can increase quality dynamically, in real-time, and avoid delays in downstream manufacturing while also optimizing test time and capacity."

www.pintail.com

Praveen Gupta's The Six Sigma Performance Handbook gives results-oriented help with Six Sigma initiatives. Readers will learn how to simplify Six Sigma methods for cost-effective implementations and how to implement DMAIC for improved performance of Six Sigma projects

Written with managers, not statisticians in mind, this book shows readers how to statistically evaluate a Six Sigma program, identify problems and make tailor-made adjustments to get desired results and revitalize a program.

A long-time Six Sigma educator and Master Black Belt, Gupta details:

· The challenges of implementing Six Sigma in a real world environment.

· The role of innovation in the Six Sigma Process.

· A step-by-step roadmap to prevent false starts and avoid common implementation mistakes.

· Forms to simplify DMAIC implementation of DMAIC.

· Tools for solving key implementation problems in the service or manufacturing environment.

· Scorecard and processes to sustain Six Sigma improvement.

· Key factors to maximize, based on the Six Sigma SIPOC and application of theory of constraints.

· Vital Lean tools for speeding up Six Sigma.

Praveen Gupta has been involved with Six Sigma since its origin in 1986. His first project, completed at Motorola under the guidance of Bill Smith, the inventor of Six Sigma, was published in Quality Engineering magazine in 1990. Praveen has continued to publish articles, monthly columns and books on Six Sigma, including Six Sigma Deployment and Six Sigma Business Scorecard.

Available through Amazon.com.

Caster Cleaner said to improve performance and extend life of conductive wheels to reduce ESD risks caused by ungrounded carts. Enhances wheel performance by continually cleaning the wheel, reducing the build-up of dirt, wax and residue that may insulate the wheel from the floor. Extends the life of floor finishes, leaves less marking on the floor and keeps floors cleaner.

Provides an additional electrical path from the wheel to the stem of the caster, bypassing potentially insulative grease in caster bearings and wheel bushings that may cause an unreliable path to ground.

Install without tools in about 5 seconds to fully assembled and loaded carts; provide visual indication that the carts are grounded.

www.Static-Dynamics.com

Optima spray fluxing system is said to improve flux deposition and through-hole penetration while eliminating post wave flux residue.

Features Ultra-Spray, which produces a precise, rectangular spray pattern; and Smart-Motion, for exact spray head speed and position control.

All set-up parameters are controlled electronically and password protected. Operator interface can store hundreds of recipes. Dual-flux tank option for rapid change between flux types. Can be retrofitted to any wave solder machine.

Ultrasonic Systems Inc., www.ultraspray.com