Atego Check automates project deliverables and reviews against predefined checklists. Initiates reviews automatically by live monitoring of computer disk folders, 15 different source code management systems, web pages, emails, dates and times, and QR codes. Reviews are automatically initiated and allocated to preauthorized Atego Check Reviewers, along with checklist, from a database of predefined and managed checklists. Reviews are comprised of lists of questions to be answered, stored and recorded with an electronic signature and timestamp. A management dashboard permits monitoring across tasks, projects, teams or programs. Works on PCs, tablets and smartphones. Has Off-WiFi/Network mode. Can build auditable checklists or choose from list of predefined safety-critical checklists.

Atego, www.atego.com 

RV-1 PWB automatic optical inspection and solder paste inspection machine inspects component mounting failures and solder printing failures. Compares PWB image data with data programmed in advance. Is equipped with 270mm large-diameter high-brightness white LED three-ring light and coaxial light. Twin linear motor, high-speed data transmission of CMOS camera and image processing library enables image shooting at 0.14 sec./frame. 3-D images synthesized from images shot with angle camera can be displayed for a final visual check. Software compares inspection images from multiple production lines.

Juki Americas, www.jukiamericas.com

BiAgX high-melt lead-free (Pb-free) solder paste is a drop-in replacement for standard high Pb-containing solder pastes. Is for small, low-voltage QFN packages used in portable electronics (smartphone/tablet), automotive electronics, and industrial applications. Is said to perform in at temperatures in excess of 150°C. Reportedly requires minimal process adjustments from standard high Pb-containing solder paste-based processes. Has passed MSL1 and thermal cycle testing at several power semiconductor customers. Is said to reflow, solder, wet and solidify like other solder pastes. Comes in dispense and printing forms. Fluxes are cleanable with standard cleaning chemistries and processes.

Indium, www.indium.com/BiAgX

EAC-7000 and ETF-700 systems are for hand assembly directly into a wave. EAC-7000 is a manual slide line system that offers a free rolling steel bearing system that permits printed circuit boards or pallets to glide from operator to operator. Is available in 15° and 0° rail sets. Includes ESD ground port, angled parts tray, overhead light and foot board. Has low-profile front fascia. Standard clip rail is included. When configured with ETF-700 (auto wave loader), operator can manually slide PCB or pallet to activate entrance sensor.

Promation, www.Pro-mation-Inc.com

585-1 nonconductive paste provides reliability to gold stud bump interconnects used in flip-chip packaging. Has high fracture toughness and adhesion. Is ionically clean and cures in seconds during thermal compression bonding at 200°C.

Engineered Material Systems, www.emsadhesives.com

PanelScan traceability and inspection system captures 1D and 2D barcode data from multi-array PCBs at the front-end or mid-stream on an SMT line. Is said to read barcodes on entire length and width of any PCB array. Intuitive user interface for quick training. Replaces manual scanning. Does not require line shutdowns to reposition, reconfigure, and test barcode readers. Comes in standard and wide configurations. Includes up to two GigE line scan cameras and lenses, up to two custom LED lights, software, trigger, and cables. Integrates into existing manufacturing execution system (MES) software.

Microscan, www.microscan.com

RP-1 solder paste printer has a special mechanism to align the bare PWB with a screen mask; drives three alignment modules attached on the outer circumference of the mask stage to adjust the position in X, Y and θ directions simultaneously. This permits repetitive printing accuracy of circumference fine adjustment to improve up to ±10μm, and duration including correction and movement time reduced to six sec. Optional automatic solder dispenser and cleaning functions available.

Juki, www.jukiamericas.com

MasterSil 705TC silicone-based, single component system sets up in 7 min. and has a noncorrosive cure at room temperature when exposed to atmospheric humidity. Is thermally conductive and electrically insulative. Is said to feature a paste consistency that doesn’t require mixing. For bonding, sealing and coating. Thermal conductivity of 14 BTU·in/(h·ft²·°F) or 2.1 W/m·K. Withstand temperatures from -60° to 400°F.  Shelf life of 6 months at room temperature.

Master Bond, masterbond.com/products/one-part-silicone-adhesives-sealants-and-coatings

γ-S330 inline SL/SR PCB separator is fully loading and unloading. A two-way sliding work exchanger limits idle time and simultaneously loads and unloads. Includes 10X CCD camera to minimize programming time and auto-fiducial mark point check and cutting route auto compensation to ensure accuracy.

Aurotek, robot.com.tw

CXP (Convection Expandable Platform) is for surface characterization of PCB local areas under reflow conditions. Is applicable for IPC-9641 concerning warpage measurement of PCB surface mount regions. Software compares warpage results to corresponding component warpage.

Akrometrix, www.akrometrix.com
 

M8000 Series BER is a highly integrated and scalable bit error ratio tester for physical-layer characterization, validation and compliance testing. Is said to enable fast, accurate receiver characterization of single- and multilane devices operating at data rates up to 16 Gb/s and 32 Gb/s. Streamlines receiver test setup. Offers built-in jitter injection, 8-tap de-emphasis, interference sources, reference clock multiplication, clock recovery and equalization. Automates in situ calibration of signal conditions. Is scalable and expandable. Supports one to four BERT channels and offers data rates of up to 8.5 Gb/s and 16 Gb/s with an extension to 32 Gb/s. Based on AXIe.

Agilent Technologies, www.agilent.com

NanoSlic Gold stencil, for solder paste printing, has a coated stencil underside and aperture walls, making them highly hydrophobic and oleophobic in order to repel solder paste. Coating is thermally cured and permanent, and said to improve solder paste transfer efficiencies for small apertures, resulting in higher yields and less rework. reportedly minimizes bridging and reduces underside cleaning. Is compatible with current assembly equipment and processes.

FCT Assembly, www.fctassembly.com