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Hydron WS 400 is a Fast Technology-based cleaning agent designed to remove water-soluble flux residues at low concentration in spray-in-air inline and batch cleaning applications. Has been formulated to penetrate the capillary spaces underneath low standoff components, applied at low concentrations of 3% to 5%.


Zestron, www.zestron.com

 

SMT PC Board Jumpers are said to quickly and easily setup and provide low-profile circuit linkage and minimal footprint for high-density, high current PCB packages on power and aluminum backplanes.  All PCB soldering applications, including reflow, may be utilized. Manufactured from copper with silver plating, and come in three different SMT jumper styles: compact, micro-miniature and miniature.

All tape-and-reel parts are packaged per ANSI/EIA-481 standard for compatibility with most vacuum and mechanical pick and place assembly systems.

Keystone Electronics, www.keyelco.com

Xpedition PCB layout platform, the first announced phase of the new Xpedition flow, addresses placement planning for performance and reuse; efficient routing of complex, dense topologies; and electromechanical optimization. Features Sketch Router, an auto-assisted routing process said to deliver hand-routed-quality in dramatically less time.

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XSDC desiccant storage cabinets feature <1% RH and below ambient temperature control. Provide closed loop desiccant regeneration. Have insulated enclosures that maintain set point temp. to within 2°C.

Super Dry, www.totech.eu..com

Echo ultrasonic generator is designed for ultrasonic spray processes. Provides high-frequency electrical energy to operate all frequencies of ultrasonic nozzles. Automatically locks onto ultrasonic nozzles’ operating frequency with phase-locked-loop technology. Offers connectivity inputs and outputs, triggering capabilities and fine-tuning spray controls, including load leveling or power leveling mode. Other features include load leveling that automatically compensates for changes in flow rate and liquid characteristics; power resolution of 0.01 watts; operation over a frequency range of 25 - 250 kHz; graphic user interface with intuitive wheel encoder, and ±4% accuracy.

Sono-Tek, www.sono-tek.com

FactView browser-based tool enables viewing of measurements such as employee daily activity, paperless dispatching of jobs, part/job work-in-process status, and machine performance showing the classic overall equipment effectiveness (OEE) measurements. Works with manufacturing execution systems (MES) to provide paperless manufacturing. Shows data in real-time via a laptop or mobile device.

Factivity, www.factivitycom

Sigma G5S modular mounter has a multi-function head that now features lead-clinching and tamping functionalities. Uses side-mounted lighting and machine vision to identify and locate through-hole component leads. During placement/insertion, clinching simultaneously takes place. Head provides tamping functionality to ensure through-hole component is properly placed, inserted, and seated; is helpful with long card edge connectors. Head picks up component with Gripper nozzle; places the connector via insertion pressure on the center of the component. Head can be programmed to tamp one end, then the other, with up to 10Kg pressure if needed.

Hitachi High Technology Instruments, www.hitachi-hta.com

Scorpion rework system now includes an automatic placement package capable of 50mm of motorized travel in the Z-axis and 360° in ϴ. Automatic placement package offers fine motor control in the Z-axis and ϴ during alignment of the component to the pad. Includes a force feedback control during the placement process, enabling the unit to pick and place components without disturbing the component or solder. Is now available in a Mobile version with a 1080p, high-def camera system that enables alignment and positioning of components before placement; is for use with smaller packages up to 25mm x 25mm. New digital controls have been implemented to control the light levels of the top and bottom LED lighting modules. Polarized filter feature is now standard. New upgrade kits include a side-view camera, contactless IR sensor, and thermal and airflow calibration kits.

Metcal, www.metcal.com 

SCPH silver conductive adhesive offers electrical conductivity and adhesion to most substrates, especially indium tin oxide and color filter substrates. Is reportedly not dissolved by Tuffy conformal coatings, which are frequently applied to the electrodes of flat panel displays. Can be coated with Tuffy alternately to simplify the assembly process. Can be used with fast-action, automatic dispensing equipment and cures at ambient temperatures within 10 min. Is halogen- and antimony-free, and requires no special storage conditions. For assembly of cellphone display modules, tablets and similar products that incorporate flat screen displays.

Electrolube, www.electrolube.com

 

 

 

GLRS laser singulation system is configurable with a near IR laser (1032nm) for use with metal-core substrates or a green laser (532 nm) for use with ultra-thin and flexible substrates. Inert gas injection at the Laser point minimizes local oxidation concerns, Particle/Gaseous remediation is affected from beneath. Vacuum is provided via two 5HP blowers and a three-stage filtration system capable of handling particles as small as 20 microns.

Getech, www.getechsys.com

 

LineMaster DM inspection machine has dual mode capability; incorporates SPI and AOI. Validates overall variables associated with component placement and solder paste printing. Detects absence/presence, polarity, OCV, misalignment, RDI and solder joint inspection for AOI and accurate and repeatable 3D volumetric measurements for SPI. Features include real-time SPC, customized data reports, offline CAD/Gerber programming and a defect repair station.

ASC International, www.ascinternational.com

 



MC-301 benchtop reflow oven is for prototyping, manufacturability testing, and short-run batch production. Has an Android-based control app; permits surface mount assemblers and product developers to meet specifications for preheat, soak, reflow, and cooling phases. Heating and cooling rates in each stage are automatically calculated. Includes internal thermocouple to measure and record actual temperatures on the printed circuit board while soldering. Real-time feedback from the thermocouple can be used to control heater power and to establish temperature settings. Heating chamber is divided into multiple heating zones; each one is assigned to its own channel of the temperature control system. Ensures delta-T ±2 °C across 10" x 8" working area. Rapid cooldown is achieved with intake fans that draw air through the bottom of the unit and out through the 3" exhaust port. Measures 27" x 19" x 11" and weighs fewer than 100 lbs.

Manncorp, www.manncorp.com  

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