SFX Gang Test Module Kit consists of three basic modules for easy-to-integrate, parallel test or programming of up to 16 or 32 units. Requires one system controller. Can be flexibly adjusted to various environments and different test and programming applications such as flash programming, MCU programming or dynamic tests per Processor Emulation. Consists of three interconnected module types – a TAP transceiver, a multipurpose parallel I/O unit, and a power management unit. For simple system integration, all modules have onboard Mass Interconnect Interfaces from Virginia Panel, and are controlled by a central controller. Supports all modern technologies for Embedded System Access (ESA). In addition to boundary scan, these are Processor Emulation and chip-embedded instruments, for design validation, hardware debugging, production test, programming without probe or nail utilization (non-intrusive). Each site can be individually programmed in several parameters (protocols, voltage, delays etc.).

Goepel, www.goepel.com

SFX Gang Test Module Kit consists of three basic modules for easy-to-integrate, parallel test or programming of up to 16 or 32 units. Requires one system controller. Can be flexibly adjusted to various environments and different test and programming applications such as flash programming, MCU programming or dynamic tests per Processor Emulation. Consists of three interconnected module types – a TAP transceiver, a multipurpose parallel I/O unit, and a power management unit. For simple system integration, all modules have onboard Mass Interconnect Interfaces from Virginia Panel, and are controlled by a central controller. Supports all modern technologies for Embedded System Access (ESA). In addition to boundary scan, these are Processor Emulation and chip-embedded instruments, for design validation, hardware debugging, production test, programming without probe or nail utilization (non-intrusive). Each site can be individually programmed in several parameters (protocols, voltage, delays etc.).

Goepel, www.goepel.com

Circuit Scribe rollerball pen comes filled with specially formulated conductive ink that dries instantly. Draws electronics circuits instantly. Produces lasts 60 to 80 meters of conductive lines. Conductivity is 50-100 milliohms per square per mil.

Electroninks Incorporated, http://www.electroninks.com/

ProtoLaser 3D has a large, height-adjustable working platform and a laser optic, which corresponds to ones used in production systems. Is for series-like 3D rapid prototyping and process optimization. Is based on the ProtoLaser concept, where working chamber is housed vibration-decoupled in a compact body.

LPKF, www.lpkf.com

ProtoLaser 3D has a large, height-adjustable working platform and a laser optic, which corresponds to ones used in production systems. Is for series-like 3D rapid prototyping and process optimization. Is based on the ProtoLaser concept, where working chamber is housed vibration-decoupled in a compact body.

LPKF, www.lpkf.com

Eexpert 10.6 rework system now comes with the Process Shuttle to streamline flux and solder paste dipping or printing, and pre-positions small surface mountable devices for pickup. Installs on Auto-Vision-Placer (AVP) systems. Features include µSMD Tool, which presents small components with an easy-access fixture, improving processing time. Specific sizes are engineered for optimal pre-alignment. Dipping Tool permits solder spheres on the underside of an area-array device to be coated with a controlled, defined volume of flux or solder paste. Different depths are available to yield specific depositions. Printer Tool permits solder paste or flux to be printed directly onto small components such as quad flat no-leads, enabling immediate placement onto a printed circuit board. Printing stencils can be easily changed to minimize process setup. Transport slide holds various shuttle tools, which feed diverse components to the rework process in a controlled manner.

Retrofits to existing Martin systems that have automated vision placement. Does not require software programming.

Martin, a Finetech Co., http://www.martin-smt.de

Eexpert 10.6 rework system now comes with the Process Shuttle to streamline flux and solder paste dipping or printing, and pre-positions small surface mountable devices for pickup. Installs on Auto-Vision-Placer (AVP) systems. Features include µSMD Tool, which presents small components with an easy-access fixture, improving processing time. Specific sizes are engineered for optimal pre-alignment. Dipping Tool permits solder spheres on the underside of an area-array device to be coated with a controlled, defined volume of flux or solder paste. Different depths are available to yield specific depositions. Printer Tool permits solder paste or flux to be printed directly onto small components such as quad flat no-leads, enabling immediate placement onto a printed circuit board. Printing stencils can be easily changed to minimize process setup. Transport slide holds various shuttle tools, which feed diverse components to the rework process in a controlled manner.

Retrofits to existing Martin systems that have automated vision placement. Does not require software programming.

Martin, a Finetech Co., www.martin-smt.de

ACE real-time temperature data logger permits placement of up to six thermocouples at critical locations on a board to obtain topside printed circuit board temperature readings. Inputs process information to soldering machine control software. Automatically correlates actual topside PCB readings with the infrared pyrometer that controls the preheat system and can directly control the preheater, if desired. Thermal data from all seven channels – six PCB thermocouples and the preheat control IR pyrometer – can be plotted and imported into a spreadsheet or other database program for further analysis graphical examination. Is compatible with advanced ACE selective soldering machines.

ACE Production Technologies, www.ace-protech.com

SpectorBOX bottom-up modular AOI is for inspection of wave and selective soldered plated through-hole and SMT components. Inspects PCBs inside solder frames directly from the conveyor system. Can be equipped with nine cameras, including an optional Z-axis moveable head. XY drive gantry with ball screw mechanics delivers high-speed inspection. 100% simultaneous inspection can be accomplished with two platform modules combined for bottom and top sides. Accommodates board sizes up to 550 x 520mm.

MEK Europe, www.mek-europe.com

SpectorBOX bottom-up modular AOI is for inspection of wave and selective soldered plated through-hole and SMT components. Inspects PCBs inside solder frames directly from the conveyor system. Can be equipped with nine cameras, including an optional Z-axis moveable head. XY drive gantry with ball screw mechanics delivers high-speed inspection. 100% simultaneous inspection can be accomplished with two platform modules combined for bottom and top sides. Accommodates board sizes up to 550 x 520mm.

MEK Europe, www.mek-europe.com

3800-MK2 automated programming system combines universal programming technology, 8th gen., with a fine-pitch handling system. Reportedly is capable of processing programmable devices from the largest QFP to the smallest WLBGA. Includes vision and pneumatic systems that provide VSP support. Provides accuracy and repeatability for packages as small as 1mm x 0.5mm. Can simultaneously support tape, tray, tube and marking.

BPM Microsystems, www.bpmmicro.com

3800-MK2 automated programming system combines universal programming technology, 8th gen., with a fine-pitch handling system. Reportedly is capable of processing programmable devices from the largest QFP to the smallest WLBGA. Includes vision and pneumatic systems that provide VSP support. Provides accuracy and repeatability for packages as small as 1mm x 0.5mm. Can simultaneously support tape, tray, tube and marking.

BPM Microsystems, www.bpmmicro.com