XF-603 flame-retardant material is for automotive under-the-hood and interior labeling applications. Is UL94 VTM-0 rated and third-party tested to FMVSS 302 automotive burn standard. Thermal transfer and flexographic ink-printable. XF-603 is a high-temperature polyimide rated to the UL94 V0 standard, with low smoke and toxicity and an operational temperature of 260°C. Also comes in a low-cost polyester (PET) (XF-611) that operates at 150°C.

Polyonics, www.polyonics.com

AquaRose is an automated water-based batch printed circuit board cleaner and resistivity of solvent extract (ROSE) cleanliness tester. Is 1m x 1m and includes Earth Smart closed-loop DI and chemical wash process. Automatic ROSE ionic cleanliness verification can eliminate the need to pull a sample and run a separate test. Process control features provide limits to be set, monitored and recorded for product/process traceability. Uses high-energy fluid dynamics cleaning design. Product drying times reportedly have been shortened 50% with rotating head dryers.  

Austin American Technology, www.aat-corp.com

This inspection method for fan-out wafer level packaging compares the image acquisition of the dies on the reconstructed wafer with the CAD data used in fabricating the wafer.

Camtek, www.camtek.com

Hot crimping resistance welding systems are for joining insulated copper wire to cable shoes or terminals. Miyachi Peco weld head mechanically holds electrodes and feeds electrical current to them. Integrated water cooling system actively cools all components to prevent overheating during production. Welding process monitor guards and stores electrical parameters. No metal stripping or removal, for maximum strength. Unique weld-to-displacement feature permits the equipment to be programmed to reach the specified compression, after which the current flow and heating is switched off. This compensates for part-to-part variation, and lets users program a parameter that is closely related to joint quality.

Amada Miyachi Europe, amadamiyachi.eu

ELM-800 laser marker works inline machine to add QR, 1D, or 2D barcodes on PCBs. Marking data does not wear off over time. Minimizes marking cycle time by using a laser head with a moving X/Y axis robot and high-speed running conveyor. Optional integrated barcode scanner and data communication, which transfers marking data to production management systems. Other options include vision camera, PCB orientation verification, and fiducial mark. Compact machine length.

Eunil, eunil-ha.com

X Line 3D x-ray inspection system enables reliable inspection of THT and pin-in-paste solder joints in compliance with IPC quality standard through a combination of 3D AXI and 2D AOI. Max fault coverage at line cycle times reportedly can be achieved. By scanning image acquisition, time-efficient quality control is possible. Hole fill levels, pin and pad wetting, bridging and solder balls can be detected with one system. Is for safe testing double-sided assembled PCBs. Covers top and bottom sides within a continuous process. Basis is real-time multi-angle image acquisition, allowing a complete 3D capture of the assembly. Integrated reconstruction methods based on planarGT provide detailed evaluation of the PCB under test layer by layer.

Goepel electronic, www.goepel.com

ECM-350 Table Coating Master works offline for small-quantity batch production. Features gantry robot (x axis) and table robot (y axis). Has ability to fix products using Multi Jig tool. Has an exhauster to inhale odor and an internal UV lamp.

Eunil, eunil-ha.com

JX-350 LED mounter supports a variety of LED nozzles and can place up to six diffusing lenses on top of the LED simultaneously for backlighting applications. Offers flexible placement system designed for LED lighting products and mid to large LCD display backlights. Can support boards up to 1,500mm and laser centering for high-speed, high-accuracy placement.  

Juki Automation Systems, www.jukiamericas.com

IM-4100 is designed to automate visual inspection processes for assembled components at facilities employing mixed production systems. Comes with a number of high-precision algorithms that use sensitive heuristic analysis to detect faulty or missing parts and determine whether factors such as positional alignment and installation angles are within acceptable limits. Performs automatic pass or fail assessment of all necessary inspection points at approximately 0.5 sec. per inspection. Also utilizes QR and bar codes to acquire assembly data from the production control system in real time, allowing it to handle a wide array of items on mixed production systems.

Screen Holdings Co., screen.co.jp

Auto Slice & View 4.0 three-dimensional (3D) reconstruction software makes 3D imaging faster, easier, more accurate and cost-effective. Enables 3D structure and composition of samples at the nanometer scale. Works with all FEI DualBeam focused ion beam (FIB)/scanning electron microscope (SEM) platforms. Imaging can be combined with analytical capabilities, such as energy dispersive x-ray spectrometry (EDS) and electron backscatter diffraction (EBSD), to ensure no information is lost in sectioning of sample. Modifies automated procedures on-the-fly, with ability to add analytical signals if an unexpected feature is revealed. Imaging and analysis can be dynamically directed to selected areas of the section or applied only on certain slices to save time. Slice & View analyses can be performed at multiple sites to permit long, unattended runs over night or weekends. Advanced tiling and stitching capabilities maintain high spatial resolution over sections larger than a single field of view. New algorithms help to ensure uniform thickness of slices and precise and reproducible placement of each cut, for higher accuracy. Redesigned interface optimizes user guidance and ensures critical information is presented, if needed. Prompted workflow approach streamlines setup of automated procedures, and any procedure can be tagged as a template to serve as the basis for future analyses.

FEI, fei.com/software/auto-slice-and-view

JT 2127-Flex hardware adapters are for testing of a variety of DIMM and SODIMM sockets (sizes and styles) using a JTAG/boundary-scan controller and supporting software. Are said to provide pin-point diagnostics from a known-good test interface to assess whether the socket is soldered correctly. Modular system comprises two basic elements: 1) a high-speed multi-channel IO module – JT 2127/DMU, and 2) a personality adapter for the chosen DIMM type – JT 2127-Flex xxx. The combination permits test signals to be sent to and from the boundary-scan source device on the UUT performing a thorough check for open pins and short circuits. In addition the voltages on the power pins of the DIMM socket are also measured. Currently supported DIMM types are xxx = 204-3, 244-mi3, 260-4 & 288-4. Other DIMM formats can be supported upon request.

JTAG Technologies, jtag.com

BF-3Di-L1 3D AOI provides measurement of components with a height range from 0-20mm, achieving 1µm height resolution. Is reportedly 50% faster than Saki’s previous 3D machine. Camera and lighting systems capture clear, detailed images with no shadowing for inspection of lifted leads, tombstones, reversed polarity, and height variations. Is available for XXL sizes, in dual-lane configurations, or with optional side-angle cameras.

Saki Shanghai Co., www.sakicorp.com