Pneumatic Actuated Keysight 307x in-circuit test fixture meets test requirements for PCBAs with high test point counts, single or dual side access, and dual stage testing. Supports ESD safe test of complex boards with 39 mil center-to-center test points. Permits testing in two stages with 80% of test contact occurring in the second stage using long travel probes. These dual stage tests usually apply for ICs that also require cooling during power up testing.

Everett Charles Technologies, ect-fsg.com/incircuit-test-fixtures

Tri-V solvent series replaces toxic cleaning chemicals such as n-propyl bromide (nPB) and trichloroethylene (TCE). Are nonflammable, and can be used on energized equipment, penetrate to clean hard to reach areas, evaporate quickly and reportedly leave no residues. Come in aerosol and bulk packaging for benchtop cleaning, immersion cleaning, or vapor degreasers. Are stabilized and safe for metals such as aluminum, magnesium, titanium and brass.

Electro-Wash Tri-V precision cleaner is nonflammable cleaner and removes flux, grease, oils, dirt, dust and other contaminants from electronic components and assemblies. Max-Kleen Tri-V removes soils including oxidized oil and grease from motors and relays. Flux-Off Tri-V flux remover is an extra-strength nonflammable solvent that removes heavy encrusted flux deposits common after circuit board assembly. Works on R, RA, RMA and synthetic fluxes.

Chemtronics, a division of Illinois Tool Works (ITW), www.chemtronics.com

Mini Swash III cleaning machine replaces StencilClean SIA. Is for low-volume PCBA cleaning. Features zero drain system with high capacity rinse, longer lifetime and usability of DI water filters, open or closed loop filtration, and traceability with barcode reader for process logging.

PBT, www.PBT-works.com

VPX-2KS is dual component cavity metering spray valve capable of spraying 2,000 chemistries. Servo controlled rotor that seals a rubberized stator produces a continuous flow for each component. Tight tolerance on sealing mechanism reportedly ensures pulse-free and drip-free operation of valve, even with low viscosity fluids. Doesn’t require routine flushing or purging; each component is metered in a separate chamber. A and B components are introduced via a disposable static mixer in the air cap to produce a fine conical shaped pattern. Valve accuracy is +/-2%, dependent on material with a viscosity range of 1 - 100,000cps.

PVA, www.pva.net

SV260 reflow vapor phase soldering machine has been redesigned. Tabletop unit offers easy front-leading, for small series and prototyping. Solders BGAs and LGAs. Handles boards sizes up to 300 x 260 x 80mm. Low energy and fluid consumption with two-chamber design and integrated heat exchanger. Live temperature monitoring without high temperature profiler. Patented maintenance-free transport system. Observation window into process chamber. 230V

IBL Technologies, ibl-tech.com

Signal Optimizer is an all-in-one software for calibration, signal creation and signal analysis of 5G candidate waveforms. Features task-based instructions that simplify complex system optimization and measurements. Brings together 5G measurement science and flexible wideband system calibrations. Can generate and analyze FBMC and F-OFDM.

Keysight Technologies, www.keysight.com

EP3UF one-component epoxy contains thermally conductive fillers with small particle sizes. Thermal resistance of 5-7 x 10-6 K•m²/W. Can be applied in bond lines as thin as 10-15µm. Thermal conductivity 9-10 BTU•in/ft²•hr•°F and volume resistivity exceeds 1014ohm-cm. Passes NASA low outgassing tests. For bonding and underfills in microelectronics packaging/assembly applications. Unlimited working life at room temperature and fast cures at temperatures down to 250°F. Tensile strength 5,000-7,000 psi and compressive strength 18,000-20,000 psi. Bonds to metals, composites, ceramics, and many plastics. Has low shrinkage upon curing. Is serviceable over temperature range of -60° to +250°F.

Master Bond, www.masterbond.com

ECM-1100 inline coating machine is used to spray coating liquid on printed circuit boards and mounted parts. Common uses include inhibiting leakage and short circuit due to humidity and contamination; inhibiting corrosion; improving fatigue life of solder joints to leadless packages, and providing mechanical support for small parts to prevent damages due to mechanical shock and vibration.

Eunil, www.eunil-ha.com

MultiEx VRSP-CN is an aqueous, alkaline broadband, multifunctional cleaning detergent suited for printed circuit boards, stencils, solder carriers and frames, and production tools. Contains organic inhibitor additives that form a thin, chemical bond layer to protect sensitive metals such as copper or nickel alloy from potential electromechanical deterioration. Has a mixing ratio of one part concentrate to three parts water.

Kolb Cleaning Technology, kolb-ct.com

Dickson Data’s TM325 Display Temperature and Humidity Logger is now available for all McDry cabinets. Has a remote probe, audio and visual alarms, and flash card data retrieval option. Other features include remote probe; USB-enabled downloading; flash memory data transfer capability; and jumbo display. A plug-in can be connected directly to logger probe, enabling data tracking and monitoring of RH levels and temperature. Download data when needed, with 24/7 feedback through min./max. and real-time display.

Seika Machinery, www.seikausa.com/
Dickson Data, www.dicksondata.com/products/TM325

GPC-R-114 nonflammable, solvent-based cleaning liquid is for manual cleaning applications such as PBA and maintenance cleaning. Dissolves post-soldering flux residues and evaporates quickly without leaving visible residues on substrates. Is compatible will most materials used in electronics assembly and cleaning processes. Noncorrosive. Easy-to-use spray gun applicator.

Balver Zinn Group, balverzinn.com

Gap Pad HC 5.0 thermal interface material is designed to manage heat generated by reduced form factor, high-power density components. Is a soft, compliant gap filling material; has a thermal conductivity of 5.0W/m-K and delivers outstanding thermal performance with low compression stress. Is reportedly ideal for applications that require minimal component or board stress during assembly, yet demand high heat transfer across the interface with very low thermal resistance.

Henkel Adhesive Technologies, www.henkel.com/brands-and-businesses/adhesive-technologies