Master Bond's LED415DC90 is a one component adhesive system that cures rapidly upon exposure to a 405nm wavelength LED light source without any oxygen inhibition.

LS350 Smart rack features four rows of 7" reel storage for a maximum capacity of 192, 7", 8mm reels in less than 1.6 sq. ft. of floor space.

Shenmao's PF606-P130N is an anti-hop lead-free solder paste that is designed for the SMT process to prevent head-on-pillow (HoP) issues.

Rohm Semiconductor's BD14210G-LA current sense amplifier IC simplifies current sensing by connecting a shunt resistor and a bypass capacitor, which reduces the number of components from 11 to just three compared to conventional configurations.

Dymax's 9200-W series of light-curable encapsulants and structural and optical-positioning adhesives is made without materials of concern known to cause skin sensitization.

Würth Elektronik's WCAP-FTXH series of capacitors is ENEC 10, cULus, and CQC certified and belongs to the X2 safety class capacitors according to IEC 60384-14.

TechnoDigm's All-In-One LED UV Curing System now includes an optional integrated UV sensor.

BuGang's M/C Nozzle Cleaner series offers simultaneous cleaning of up to 24 nozzles at a speed of 12 seconds per nozzle.

AIM Solder's H10 is a halogen-free no clean solder paste capable of transfer efficiency greater than 90% on area ratios of 0.50 and a stencil life of more than 8 hours.

Rohm Semiconductor's BD7xxL05G-C series of primary LDO regulators features a rated input voltage of 45V and 50mA output current optimized for redundant power supplies.

Heraeus Electronics' Microbond SMT660 Innolot 2.0 no-clean printing T4 solder paste is a  high reliability, high performance solder paste that provides a competitive TCO offering.

Shenmao's PF735-PQ10-10L is a low melting point lead-free solder paste that has been designed for the SMT process and is meant to increase production capacity in the high-speed printing process.