Vishay Intertechnology has has expanded its frequency control line with new surface mount crystals and oscillators designed to deliver smaller packages, wider value ranges and improved performance.

Shenmao's PF606-P275 lead-free, no-clean, zero- halogen solder paste is designed for fine-pitch applications, including SMT processes and portable devices such as smartphones.

Master Bond's Supreme 121AOND toughened, non-drip epoxy is a two-component, heat-curing system with a thixotropic paste consistency.

Ersa's HR 600P tabletop rework system offers automatic residual solder removal and reproducible soldering results.

Vishay's VOR1060M4 solid-state relay offers a 600V load voltage and isolation voltage of 3750VRMS in the low-profile SOP-4 package.

Kyocera AVX's newest addition to its CR series of high-power chip resistors is said to be the industry’s highest power 0603 resistor.

Saki's 3Xi-M200v3 x-ray automated inspection system is its latest addition to the 3Xi-M200 AXI series, achieving three times the resolution of its predecessors while reducing inspection times by up to 50%.

Indium's CW-807RS halide- and halogen-free flux-cored wire improves wetting speeds and cycle times for electronics assembly and robot soldering applications.

Mycronic's MYPro A40SX and A40LX are the latest additions to its MYPro A40 pick-and-place platform, equipped with new MX7 high-speed mounthead technology.

Unigen's DDR5 family of high-performance memory modules are intended to meet the growing demand for bandwidth, capacity and power efficiency in compute, storage, networking, AI and industrial applications.

Hirose Electric's K.FL2 series of micro RF connectors feature a low profile of 1.2mm when mated.

Vishay Intertechnology's Siliconix SiJK140E 40V MOSFET is said to reduce on-resistance by 32% while offering 58% lower on-resistance than 40V MOSFETs in the TO-263-7L.