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Shenmao SH-0595-210 (Sn95Pb5) and SH-05X25-210 (Sn92.5Pb5Ag2.5) solder pastes are for high-power component assembly in power electronics.

Are halogen-free (ROL0) and feature advanced flux chemistry for consistent soldering under narrow reflow windows. Optimized for copper lead frames and die surfaces, and are said to offer good wetting, low flux residue and minimize solder splash in thermal environments. Voiding performance and printability support reliability in applications such as IGBT modules, automotive systems and energy conversion devices.

Shenmao America

www.shenmao.com

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