ARLINGTON, VA – Jedec Solid State Technology Association has published release 4 of the DDR3 serial presence detect document.

The updated specifications support three new memory module types, and are now available for free download at http://www.jedec.org/sites/default/files/docs/4_01_02_11R21A.pdf.

The JC-45 Committee for Memory Modules developed the SPD specification in conjunction with the development of the new module types, with the objective of enabling performance optimizations based on the characteristics of the DDR3 memories used on each module. 

“This release of the DDR3 SPD specification adds support for load reduction DIMMs used in high-end computing platforms and also for 16b-SO-DIMMs and 32b-SO-DIMMs used for embedded applications such as printers,” said Mian Quddus, chairman of Jedec's JC-45 Committee for DRAM Modules.

Modules using the new parameters in DDR3 SPD document release 4 will be released by manufacturers in the next year, Jedec says.

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