CIRCUITS ASSEMBLY to Co-Host Apex Panels
Published: 25 March 2009
by Mike Buetow
LAS VEGAS -- CIRCUITS ASSEMBLY and Global SMT & Packaging will cohost a free series of technical presentations on electronics manufacturing during Apex at their combined booths.
The range of presentations will cover a number of process-related issues. Panel discussions will also be held, with topics ranging from cleaning, printing and pick-and-place to solder and test.
Tuesday, March 31
| Time | Presentation | Presenter/Moderator |
| 11:00-12:00 | Cleaning panel discussion Panelists: Mike Konrad (Aqueous Technologies), Steve Stach (Austin American), Mike Bixenman (Kyzen) and Dr. Harald Wack (Zestron). | Trevor Galbraith, Global SMT |
| 12:00-12:30 | MagnaPrint - The advantages of a universal squeegee system | Charlie Moncavage, Ovation |
| 12:30-1:00 | LUNCH BREAK | |
| 1:00-1:30 | Printing challenges with today's miniature components | Mike Scimeca, FCT Assembly |
| 1:30-2:00 | Innovative PCB cleaning fluids for cleaning leading-edge technologies | Mike Bixenman, Kyzen |
| 2:00-2:30 | Reballing and prebumping BGAs, CSPs and QFNs | Jan Martin, Manncorp |
| 2:30-3:30 | Process reliability in selective soldering | Christian Ott, SEHO USA |
| 3:00-3:30 | Embedded device technology | Mark McMeen, STI Electronics |
| 3:30-4:00 | Reducing reflow costs in a challenging economy | Fred Dimock, BTU |
Wednesday, April 1
| Time | Presentation | Presenter/Moderator |
| 11:00-12:00 | Printing panel discussion Panelists: Rita Mohanty (Speedline), Mike Scimeca (FCT) and Tim Jensen (Indium) | Mike Buetow, CIRCUITS ASSEMBLY |
| 12:00-12:30 | Stencil cleaning for improved print yields | Bill Schreiber, Smart Sonic Corp. |
| 12:30-1:00 | Thermal quality management program | Grant Peterson, ECD |
| 1:00-1:30 | LUNCH BREAK | |
| 1:30-2:00 | New innovations for profiling PCBs | Brian O'Leary, KIC |
| 2:00-2:30 | White residue, electrical leakage and metal crystals - the rush to clean 'no clean' | Mike Konrad, Aqueous Technologies |
| 2:30-3:30 | Pick and place panel discussion Panelists: Bob Waters (Juki), Derek Gaston (Europlacer) and Leo Van De Val (Assembléon) | Trevor Galbraith, Global SMT |
| 3:30-4:00 | Is automated selective soldering right for you? | Eddie Groves, Pillarhouse Int'l |
| 4:00-5:00 | Soldering & profiling panel discussion Panelists: Keith Sweatman (Nihon Superior), Fred Dimock (BTU) and Michael Limberg (KIC) | Mike Buetow, CIRCUITS ASSEMBLY |
Thursday, April 2
| Time | Presentation | Presenter/Moderator |
| 11:00-12:00 | Test and inspection panel discussion Panelists: Steve Case (Cyberoptics), Brian D'Amico (MIRTEC), Chris Cain (Agilent) and Ron Lindell (VJ Electronix) | Trevor Galbraith, Global SMT |
| 12:00-12:30 | Head in Pillow - BGA defects | Mike Burgess, AIM Solder |
