LAS VEGAS -- CIRCUITS ASSEMBLY and Global SMT & Packaging will cohost a free series of technical presentations on electronics manufacturing during Apex at their combined booths.

The range of presentations will cover a number of process-related issues. Panel discussions will also be held, with topics ranging from cleaning, printing and pick-and-place to solder and test.

Tuesday, March 31

TimePresentationPresenter/Moderator
11:00-12:00Cleaning panel discussion
Panelists: Mike Konrad (Aqueous Technologies), Steve Stach (Austin American), Mike Bixenman (Kyzen) and Dr. Harald Wack (Zestron).
Trevor Galbraith, Global SMT
12:00-12:30MagnaPrint - The advantages of a universal squeegee systemCharlie Moncavage, Ovation
12:30-1:00LUNCH BREAK 
1:00-1:30Printing challenges with today's miniature componentsMike Scimeca, FCT Assembly
1:30-2:00Innovative PCB cleaning fluids for
cleaning leading-edge technologies
Mike Bixenman, Kyzen
2:00-2:30Reballing and prebumping BGAs, CSPs and QFNsJan Martin, Manncorp
2:30-3:30Process reliability in selective solderingChristian Ott, SEHO USA
3:00-3:30Embedded device technologyMark McMeen, STI Electronics
3:30-4:00Reducing reflow costs in a challenging economyFred Dimock, BTU


Wednesday, April 1

TimePresentationPresenter/Moderator
11:00-12:00Printing panel discussion
Panelists: Rita Mohanty (Speedline), Mike Scimeca (FCT) and Tim Jensen (Indium)
Mike Buetow, CIRCUITS ASSEMBLY
12:00-12:30Stencil cleaning for improved print yieldsBill Schreiber, Smart Sonic Corp.
12:30-1:00Thermal quality management programGrant Peterson, ECD
1:00-1:30LUNCH BREAK 
1:30-2:00New innovations for profiling PCBsBrian O'Leary, KIC
2:00-2:30White residue, electrical leakage and metal crystals - the rush to clean 'no clean'Mike Konrad, Aqueous Technologies
2:30-3:30Pick and place panel discussion
Panelists: Bob Waters (Juki), Derek Gaston (Europlacer) and Leo Van De Val (Assembléon)
Trevor Galbraith, Global SMT
3:30-4:00Is automated selective soldering right for you?Eddie Groves, Pillarhouse Int'l
4:00-5:00Soldering & profiling panel discussion
Panelists: Keith Sweatman (Nihon Superior), Fred Dimock (BTU) and Michael Limberg (KIC)
Mike Buetow, CIRCUITS ASSEMBLY


Thursday, April 2

TimePresentationPresenter/Moderator
11:00-12:00Test and inspection panel discussion
Panelists: Steve Case (Cyberoptics), Brian D'Amico (MIRTEC), Chris Cain (Agilent) and Ron Lindell (VJ Electronix)
Trevor Galbraith, Global SMT
12:00-12:30Head in Pillow - BGA defectsMike Burgess, AIM Solder

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