DARPA Allocates $10M to Remove Heat from Semis
Published: 05 August 2008
by Staff
ARLINGTON, VA – The Defense Advanced Research Projects Agency provided Northrop Grumman's Electronic Systems a $1.7 million contract to develop an ultra high capacity hybrid thermal ground plane to fight semiconductor-generated heat employed in electronic systems.
The 18-month contract follows a $1.5 million contract awarded earlier this year to the University of Colorado, Boulder and Lockheed Martin to work on comparable technology.
Together, both contracts eventually could be worth about $10 million, says the agency, provided all phases are completed.
These agreements come on the heels of a recent Navy report predicting shipboard cooling requirements would double every six years for the next 20 years.
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