3Di inline AOI system is for inspection of high-density printed circuit boards and boards with combinations of small and tall components.

Is equipped with new camera that reduces cycle and produces ultra-sharp high-res 3-D images; can simultaneously inspect extremely small parts (008004 and 0201) and tall parts. Features camera resolution of 8μm, height measurement 25mm, and imaging speed of 4,500 mm2/s.


Saki Corporation

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