EP4S-80 one-component silver-filled epoxy meets NASA low outgassing requirements.

Has unlimited working life at room temp. and heat cure requirement of 80°C. Has viscosity of 10,000-15,000cps. Is reportedly ideal for EMI/RFI shielding and static dissipation. Can also be used in applications where electrical conductivity is required: bonding, sealing, coating, gap filling and encapsulating. Features excellent mechanical properties with tensile modulus of 500,000-600,000psi and compressive strength of 22,000-24,000psi at 25°C. Electrically conductive system offers volume resistivity of 0.02-0.06 ohm-cm and thermal conductivity of 1.30-1.44W/(m•K). Upon curing, it offers low shrinkage, excellent dimensional stability and glass transition temp. of 130-135°C. Serviceable over temp. range of -60°C to +150°C. Adheres well to substrates such as metals, composites, glass, ceramics, semiconductor materials and many plastics.

Master Bond
masterbond.com

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