New software on 3Xi-M110 inline 3D-AXI system for printed circuit board inspection reduces cycle time up to 50%.
Has x-ray imaging mode and optimized control and motor speed. Enables machine to meet needs for automated inline x-ray inspection of entire boards, delivering high-speed 3-D volumetric inspection, maintaining inspection accuracy. Planar CT technology detects solder joint defects and microstructure abnormalities in high-density PCBs. Identifies voids in solder of BGAs mounted on boards and non-wetting shapes such as head-in-pillow caused by non-wetting of solder, as well as detecting defective parts.