PF606-P245X solder paste has wide reflow window.

Can fit into process of complicated PCB designs. Special alloy design provides excellent reliability and improves life of electronic assembly products. Developed for high-speed network and communication applications. Provides long-term stability over wide range of temperature conditions. No-clean paste provides consistent printing performance, low voiding, stable viscosity life, and excellent testability.

Shenmao
shenmao.com

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