rLSR Mini LED rework system enables industry to solder temperature-sensitive, warpage-prone, fine-pitch, odd form, big die, SiP, wearables, flex to flex, and other applications.
Beam shaping optical module takes energy of spot laser and turns it into uniformly distributed area laser. Uniformity of energy is reportedly greater than 95%. Energy of spot laser is spread evenly, allowing for same amount of energy density over entire area to be soldered. Enables proper coalescence, wetting and intermetallic formation, forming final electronic interconnect or solder joint. Automatically attaches/detaches mini-LEDs on mini-LED substrates. When applied to production line of backlight panels of tablet PCs and notebook PCs, it reportedly provides rework yield rate of 99% or higher.