S3X70-E160DN solder paste offers consistency without slumping.

Is halogen-free and can be used in Mycronic MY machines. Is designed for high-speed and fine-pattern jet dispensing over 50k dots. Is used for prototypes, reducing need for stencils. Program can be adjusted to change size and/or location of dots. Suited for automotive, aerospace, and military applications. Ensures good meltability for dispensing application solder paste in N₂ atmosphere reflow. Is resistant to temp. variations. Solder alloy is Sn 3.0Ag 0.5Cu (SAC 305); leaded options are available. Can be supplied in syringe. Solder powder and flux of consistent viscosity in continual use maintain fine-print shapes in long-term use.

Koki
ko-ki.co.jp/en/

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