Sideview BGA inspection system features tiny optical probe with built-in high-power lighting and 90° viewing angle.

Produces high-resolution images of low-clearance areas beneath BGAs, μBGAs, CSP, CGA and flip chip packages, with as low as 40µm standoff. Discovers micro-cracks, cold solder joints, whiskers, missing balls, scaling, excess flux and other soldering issues. Variable focus capability of optics allows user to image from first to up to 20 rows of BGA solder bumps with electronically dimmable fiber brush light as background illumination. Soft-touch mechanism design of stand bracket protects micro-prisms in optical probe tip from damage when positioned on surface of PCB under inspection. Features 5mp USB3.0 digital microscope and integrated fiber brush-light mounted on compact, robust stand with XY-translation stage. 180° pivoting mechanism facilitates alignment of probe along three different sides of BGA package. Is available in two system levels: Basics and ProX.

BGA Inspectis



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