Fox2 modular pick-and-place technology is now expandable in any direction.

Combines jetting/dispensing, 2.5-D placement, electrical testing, inventory control and traceability. Has machine footprint of under 11 sq. ft. and can accept PCB sizes up to 16" x 12". Components with sizes from 01005 up to 3.15" x 3.15" can be placed. Machine achieves 10,800 cph at 50µm with a two-nozzle head. Can be configured with up to 180 feeders. Can be fitted with jet valve for SMD glue or solder paste for manufacturing 2.5-D assemblies or micro-screw valve. Features ePlace software.

Essemtec
essemtec-usa.com

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