SMT 158D diamond-filled underfill has thermal conductivity of 6W/mK.

Is rapid-curing, fast-flowing and easily reworked liquid epoxy that can be used for flip chips, chip scale packages, BGA devices, package and land grid array applications. Is also suitable for bare chip protection in advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules. Is reportedly easily dispensed, minimizes induced stresses and provides outstanding reliability performance and excellent mechanical resistance.

Yincae Advanced Materials
yincae.com

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