Alpha OM-550 low temperature solder paste pairs with HRL1 alloy for assemblies with temperature-sensitive substrates, components and high-warpage chips. Reduces soldering temperature required for SAC alloys by 50°C, while reducing power consumption and carbon emissions.

Is said to reduce up to 99% and significantly reduce defects. Has characteristics of a modern solder paste designed for motherboards but with the ability to reflow at lower temperatures, therefore minimizing NWO and HIP defects in complex assemblies.

Alpha Assembly Solutions

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