Alpha OM-550 low temperature solder paste pairs with HRL1 alloy for assemblies with temperature-sensitive substrates, components and high-warpage chips. Reduces soldering temperature required for SAC alloys by 50°C, while reducing power consumption and carbon emissions.

Is said to reduce up to 99% and significantly reduce defects. Has characteristics of a modern solder paste designed for motherboards but with the ability to reflow at lower temperatures, therefore minimizing NWO and HIP defects in complex assemblies.

Alpha Assembly Solutions

alphaassembly.com

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
Don't have an account yet? Register Now!

Sign in to your account