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TrueHeight Preforms are engineered with embedded spacer technology said to address all major applications requiring 75µm bondline and above.

Permit ease of implementation and maximum soldering performance. Design architecture addresses bondline thickness requirement and reduces opportunity for voiding. Minimizes areas where gases can be trapped during reflow. Can be flux-coated from a range of fluxes.

Alpha Assembly Solutions

alphaassembly.com

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