Alpha CVP-360 Pb-free, no-clean solder paste is formulated with low-Ag SACX 0807 and 0307 alloys. Reportedly delivers excellent printing characteristics, permitting the use of Type-3 solder powder, even when 300 µm features are being printed using a 125 µm stencil. Permits high-speed printing; reduced stencil-cleaning frequency. Has a wide reflow process window.
 
Cookson Electronics Assembly Materials, www.cooksonelectronics.com

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