The VT-S700 inline AOI system uses a telecentric lens with a 2-MP camera. Is said to reduce image distortion and improve inspection accuracy at the edges of large field-of-view. Delivers inspection of up to 10 µm for components as small as 01005 and down to -0.012" pitch. Uses three-color highlight system that illuminates PCB in a 360° dome. 3-CCD camera enhances solder shape recognition accuracy. Other features include color-enhancing capability, integrated graphical user interface and logic customization. Optical character verification is available. Resolution can be selected for 10, 15 or 20 µm. Separate models are available to handle 10 x 13" and 18 x 20" boards.

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